Method of manufacturing multilayer ceramic electronic part

Abstract

[Problem] To provide a method of manufacturing a multilayer ceramic electronic part such that by providing a desired insulator section thickness for side faces of a multilayer chip, a multilayer ceramic electronic part having stable electrical characteristics and high-reliability can be obtained. [Solution] Provided is a method of manufacturing a multilayer ceramic electronic part, said method comprising: a process for preparing multilayer chips that are formed such that both side end-edges of internal electrodes are exposed at the side faces thereof; a process for forming a first insulator section and a second insulator section by pressing one side face and the other side face of the multilayer chips onto a metal plate, which comprises slots having an arbitrary volume and having an insulator-section paste filled into the slots having the arbitrary volume, and oscillating the metal plate in an arbitrary direction when separating the multilayer chips from the metal plate; and a process for firing the multilayer chips having the first insulation section and the second insulation section formed thereon. The insulator-section paste is characterized by having a viscosity of 500 Pa·s-2,500 Pa·s, and by the inorganic-solid-constituent content (C) (vol%) thereof satisfying a prescribed condition.

Description

technical field [0001] The present invention relates to a method of manufacturing laminated ceramic electronic components such as laminated ceramic capacitors. Background technique [0002] Conventionally, a multilayer chip before firing a multilayer ceramic electronic component was manufactured by printing a plurality of internal electrodes equivalent to one multilayer chip vertically and horizontally on a ceramic green sheet, and stacking and pressing the ceramic green sheets according to the required number. Afterwards, dicing is performed into individual chip shapes. In this method, in relation to the accuracy of the lamination position of the ceramic green sheet or the positional accuracy of the shape for dicing the laminate chip, it is necessary to ensure that the insulator portion on the side surface (the surface without the lead-out electrode) of the laminate chip has A certain width. Therefore, there are problems such as that the size of the multilayer chip may in...

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Problems solved by technology

[0008] However, even if the paste for the insulator part is shared with the ceramic material used in the laminated body on the side surface of the laminated body chip, and a solvent that does not dissolve the laminated body is used, there is a problem that the above-mentioned In the case of applying the paste for the insulator portion to the side surface of the laminated chip by the conventional method as described above, the coating thickness on the edges of the laminated chip exceeds the allowable range for maintaining electrical characteristics and becomes thinner, or cannot be smoothed. Coating, etc.

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