Method for preparing conductive metal film
A technology of metal conduction and thin film, which is applied to the direction of conductive layer, circuit, electrical components, etc. problem, to achieve the effect of improving adhesion, improving adhesion, and improving adhesion
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[0051] In order to make the object, technical solution and advantages of the present invention clearer, various embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. However, those of ordinary skill in the art can understand that, in each implementation manner of the present invention, many technical details are provided for readers to better understand the present application. However, even without these technical details and various changes and modifications based on the following implementation modes, the technical solution claimed in each claim of the present application can be realized.
[0052] The first embodiment of the present invention relates to a method for preparing a metal conductive film. Such as figure 1 Shown is the flow chart of the method for preparing metal conductive thin film in this embodiment mode, will combine below figure 1 The whole preparation process is introduced in detail.
[0053...
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Abstract
Description
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