Ge-doped silicon substrate, its preparation method and solar cell comprising it
A technology for solar cells and silicon substrates, applied in the field of solar cells, can solve problems such as high cost, segregation, and less available polysilicon, and achieve the effect of improving light attenuation and improving problems
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[0031] Those skilled in the art are able to select an appropriate method to obtain a corresponding germanium-doped silicon substrate under the teaching of the above-mentioned germanium-doped silicon substrate structure of the present invention. In a preferred embodiment of the present invention, the preparation method of the germanium-doped silicon substrate includes the following steps: providing a P-type crystalline silicon body 10; performing germanium-doped treatment on the upper surface of the P-type crystalline silicon body 10 to form a first germanium doped region 110 .
[0032] Compared with the method of doping germanium before the crystalline silicon ingot or rod in the prior art, in the preparation method provided by the present invention, the germanium doping treatment is carried out after the crystalline silicon ingot or rod is drawn. Since the segregation coefficient of germanium atoms is too low, only about 0.33, if germanium atoms are directly added to silicon ma...
Embodiment 1
[0052] 2000 P-type crystalline silicon wafers made of texture (the upper surface area of a single wafer is 24336mm 2 , with a mass of 9.86g) placed in a tube in a diffusion furnace so that its upper surface is exposed in the tube. The temperature of the diffusion furnace was raised to 550° C. within 1200 s, and nitrogen gas was introduced during this process to remove the air in the furnace tube. Keep the temperature constant, after 120s of stabilization. Introduce appropriate amount of nitrogen gas into the germane source bottle, and then infiltrate germane (0.15g) into the furnace tube within 20s. Keep the temperature constant, so that the germane decomposition time lasts 900s. Deposit germanium atoms on the upper surface of the silicon wafer; continue to raise the temperature to 750°C, and control the heating time at 600s. Maintain the temperature of 750°C for 1200s to obtain a silicon wafer with the first germanium-doped region; pass phosphorus oxychloride and oxygen ...
Embodiment 2
[0056] 2000 P-type crystalline silicon wafers made of texture (the upper surface area of a single wafer is 24336mm 2 , with a mass of 9.87g) placed in a tube in a diffusion furnace so that its upper surface is exposed in the tube. The temperature of the diffusion furnace was raised to 280°C within 180s, and nitrogen gas was introduced during this process to remove the air in the furnace tube. Keep the temperature constant, after 120s of stabilization. Introduce appropriate amount of nitrogen gas into the germane source bottle, and then infiltrate germane (0.12g) into the furnace tube within 20s. Keep the temperature constant, so that the germane decomposition time lasts 900s. Deposit germanium atoms on the upper surface of the silicon wafer; continue to raise the temperature to 750°C, and control the heating time at 600s. Maintain the temperature of 750°C for 1200s to obtain a silicon wafer with the first germanium-doped region; pass phosphorus oxychloride and oxygen into...
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