A LED packaging process

Abstract

The invention discloses an LED packaging process, which includes the following steps: crystal bonding: a crystal bonding machine spots UV light-curable LED crystal bonding glue in the crystal bonding areas of multiple brackets on the bracket assembly, and places the crystal grains on The crystal-bonding area on each bracket; UV light curing: the UV light curing machine cures the UV light-curing LED crystal-bonding glue; welding wire: the wire bonding machine welds the two ends of the metal wire to the electrode of the crystal grain and the bracket respectively. On the electrode, multiple LED semi-finished products are formed on the bracket assembly; dispensing: the dispensing machine pots the UV light-curing LED encapsulation glue on the grains of each LED semi-finished product; UV light curing: the UV light curing machine applies UV The light-curing LED encapsulation glue is cured, so that multiple LED finished products are formed on the bracket assembly; selectivity is increased: blanking: use a blanking machine to separate the LED finished product from the bracket assembly to form multiple independent LED finished products; sorting: Use the sorting machine to carry out quality inspection and screening of LED finished products. The invention has short time consumption, low energy consumption, extremely high production efficiency, and is convenient to realize full automation.

Description

Technical field: [0001] The invention relates to the technical field of LED encapsulation technology, in particular to an LED encapsulation process with short time consumption, low energy consumption, high production efficiency and full automation. Background technique: [0002] With the increasing emergence of energy and environmental issues, more and more attention has been paid to the energy-saving industry and its products, and the energy-saving effect of semiconductor diode (LED) lighting has been recognized. [0003] LED (Light Emitting Diode, light-emitting diode) is a solid-state semiconductor device that can convert electrical energy into visible light, and it can directly convert electrical energy into light energy. LED is widely used as a new lighting source material. The LED packaging technology plays a key role in the light-emitting efficiency of light-emitting diodes. [0004] The traditional LED packaging process generally includes the following steps: solid...

AI Technical Summary

Problems solved by technology

[0005] The above-mentioned traditional LED encapsulation process has the following disadvantages: the thermosetting resin used in the die-bonding step must be baked in a hot oven (at a temperature of 150° C.) for at least 60 minutes to cure the thermosetting resin; The silica gel used in the glue step needs to be baked in a hot oven (at 150°C) for 120-300 minutes to cure the silica gel. Therefore, the entire LED packaging process takes a long time, which is not conducive to the realization of fully automatic production of the entire process. , leading to low production efficiency

In addition, due to the longer baking time, higher electrical energy is required, that is, higher production costs are required, so that it cannot meet the needs of modern development and improve market competitiveness.

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