Antistatic organosilicon gel used for heat-conducting gasket and preparation method of the organosilicon gel

A heat-conducting gasket and silicone technology, applied in the field of silicone electronic materials, can solve the problems of affecting the combination of colloid and substrate, poor antistatic effect, insufficient adhesion, etc., achieving good antistatic effect, fast heating and curing, Good adhesion effect

Inactive Publication Date: 2014-03-05
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Domestic silicone gels that can be used in this field have some defects, such as insufficient adhesion, poor stickiness, and poor antistatic e...

Method used

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  • Antistatic organosilicon gel used for heat-conducting gasket and preparation method of the organosilicon gel
  • Antistatic organosilicon gel used for heat-conducting gasket and preparation method of the organosilicon gel
  • Antistatic organosilicon gel used for heat-conducting gasket and preparation method of the organosilicon gel

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0064] Preparation of component A: Weigh the viscosity of 10000 centipoise such as structural formula (1), where R 1 for-Vi, R 2 46.95 g of double-terminated vinyl polysiloxane (vinyl content: 0.1 wt%) of -Me, with a viscosity of 100 centipoise, such as structural formula (1), where R 1 , R 2 15.0g of -Vi terminal and side vinyl polysiloxane (vinyl content 10wt%), vinyl MQ resin such as molecular formula 1 (viscosity of 500 centipoise, vinyl content 5wt%) 35g, add adhesive such as Structural formula (3), n=5, 0.05g, add antistatic agent, such as structural formula (7), n=10, 2.0g, catalyst platinum (0)-2,4,6,8-tetramethyl-2, 1.0 g of 4,6,8-tetravinylcyclotetrasiloxane complex solution, with a platinum content of 1000 ppm, was sequentially added into the mixer, mixed and stirred evenly, and the A component was obtained;

[0065] Preparation of component B: Weigh the viscosity of 500 centipoise such as structural formula (1), where R 1 for-Vi, R 2 79.9g of double-terminated...

Embodiment 2

[0068] Preparation of component A: Weigh the viscosity of 2000 centipoise such as structural formula (1), where R 1 for -Vi, R 2 77.89g of double-terminated vinyl polysiloxane (vinyl content 0.2wt%) of -Me, vinyl MDT resin such as molecular formula 2 (viscosity of 500 centipoise, vinyl content 5wt%) 20.0g, add adhesive Such as structural formula (4), n=10, 2.0g, add antistatic agent, such as structural formula (8), n=20, 0.01g, catalyst platinum (0)-2,4,6,8-tetramethyl-2 , 0.1g of 4,6,8-tetravinylcyclotetrasiloxane complex solution, platinum content 10000ppm, sequentially added to the mixer, mixed and stirred evenly to obtain the A component;

[0069] Preparation of component B: Weigh the viscosity of 500 centipoise such as structural formula (1), where R 1 for-Vi, R 2 64.0g of double-terminated vinyl polysiloxane (vinyl content 0.5wt%) of -Me, vinyl MDT resin such as molecular formula 2 (viscosity of 10000 centipoise, vinyl content 0.01wt%) 20.0g, hydrogen-containing polys...

Embodiment 3

[0072] Preparation of component A: Weigh the viscosity of 1000 centipoise such as structural formula (1), where R 1 for-Vi, R 2 62.2g of double-terminated vinyl polysiloxane (vinyl content: 0.3wt%) of -Me, with a viscosity of 2000 centipoise, such as structural formula (1), where R 1 , R 2 15.0g of terminal and side vinyl polysiloxane (vinyl content 8wt%) for -Vi, vinyl MDT resin such as molecular formula 2 (viscosity 5000 centipoise, vinyl content 3.6wt%) 20.0g, add adhesive Agent such as structural formula (5), n=15, 1.0g, add antistatic agent, such as structural formula (7), n=20, 1.2g, catalyst platinum (0)-2,4,6,8-tetramethyl- Add 0.6 g of 2,4,6,8-tetravinylcyclotetrasiloxane complex solution, with a platinum content of 5000 ppm, into the mixer in sequence, mix and stir evenly, and obtain the A component;

[0073] Preparation of component B: Weigh the viscosity of 500 centipoise such as structural formula (1), where R 1 for -Vi, R 2 64.5g of double-terminated vinyl p...

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Abstract

The invention relates to antistatic organosilicon gel used for a heat-conducting gasket and a preparation method of the organosilicon gel. The organosilicon gel comprises an A component and a B component in a weight ratio of 1:1. The A component comprises following raw materials by weight: 95-99.84 parts of a basic material, 0.1-1 part of a catalyst, 0.05-2 parts of an adhesive and 0.01-2 parts of an antistatic agent. The B component comprises following raw materials by weight: 84-94.9 parts of the basic material, 5-15 parts of a cross-linking agent and 0.1-1 part of an inhibitor. The organosilicon gel prepared by the invention has good fluidity. After sulfuration, the organosilicon gel has excellent adhesive property, holding power and antistatic property.

Description

technical field [0001] The invention relates to an antistatic organic silicon gel used for heat conduction pads and a preparation method thereof, belonging to the technical field of organic silicon electronic materials. Background technique [0002] Thermal pads are mainly used to fill the air gap between the heating device and the heat sink or metal base, covering very uneven surfaces, so that the heat can be transferred from the separation device or the entire PCB to the metal shell or the diffusion plate, and improve the heat-generating electronic components. efficiency and extend its service life. [0003] At present, the materials used in thermal pads are achieved by selecting the appropriate resin and then adding certain thermal conductive fillers, flame retardants, pigments, plasticizers and anti-scorch agents to achieve the desired effect. The resin usually selected is one or more of epoxy resin, acrylate resin and silicone resin; epoxy resin has poor temperature re...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/05C08L83/04C08L83/12C08L71/00C08K5/5415C08K5/05
Inventor 陈维张丽娅王建斌陈田安
Owner YANTAI DARBOND TECH
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