Fluorescent material capable of eliminating white-light LED (Light-Emitting Diode) color temperature deviation

A fluorescent material and LED packaging technology, applied in the field of optoelectronics, to achieve the effect of increasing the yield, reducing the problem of yellow circles, and improving the uniformity of light and color

Inactive Publication Date: 2014-03-12
SOUTHEAST UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Currently there is no effective technology to solve this problem

Method used

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  • Fluorescent material capable of eliminating white-light LED (Light-Emitting Diode) color temperature deviation

Examples

Experimental program
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Effect test

Embodiment 1

[0033] This embodiment is to prepare a fluorescent material containing 17 micron YAG yellow phosphor powder and 50 micron silicate hollow glass microspheres, which is used in epoxy resin encapsulation glue.

[0034] First, weigh 10 grams of YAG yellow phosphor powder with a dominant wavelength of 571nm and a central particle size of 17 microns (the specific gravity is 4.5g / cm 3 ), and then weighed 1.1 grams with a specific gravity of 0.7g / cm 3 , and silicate hollow glass microspheres with a central particle diameter of 50 microns, and fully mix the two. The fluorescent material can be combined with epoxy resin glue (the specific gravity is 1.1g / cm 3 ) is used to package white light LEDs with a color temperature between 5700K and 6500K, and the color temperature deviation of the product is not greater than 30K.

Embodiment 2

[0036] This example is to prepare a fluorescent material containing 14 micron YAG yellow phosphor powder and 40 micron silicate hollow glass microspheres, which is used in a silicone resin encapsulant.

[0037] First, weigh 10 grams of YAG yellow phosphor powder with a dominant wavelength of 569nm and a central particle size of 14 microns (the specific gravity is 4.5g / cm 3 ), and then weighed 1.1 grams with a specific gravity of 0.7g / cm 3 , silicate hollow glass microspheres with a central particle diameter of 40 microns, and fully mix the two. The fluorescent material can be combined with silicone resin (specific gravity 1.15g / cm 3 ) for packaging white LEDs with a color temperature between 7000K and 8000K, and the color temperature deviation of the product is not greater than 40K.

Embodiment 3

[0039] This example is to prepare a fluorescent material containing 18 micron YAG orange phosphor powder and 50 micron silicate hollow glass microspheres, which is used for encapsulation of warm white LEDs in combination with silicone resin encapsulation glue.

[0040] First, weigh 10 grams of YAG orange fluorescent powder with a dominant wavelength of 579nm and a central particle size of 18 microns (the specific gravity is 4.5g / cm 3 ), and then weighed 1.1 grams with a specific gravity of 0.70g / cm 3 , and silicate hollow glass microspheres with a central particle diameter of 50 microns, and fully mix the two. The fluorescent material can be combined with silicone resin (specific gravity 1.15g / cm 3 ) is used to package warm white LEDs with a color temperature of about 3300K, and the color temperature deviation of the product is not greater than 20K.

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Abstract

The invention discloses a fluorescent material capable of eliminating white-light LED (Light-Emitting Diode) color temperature deviation. The fluorescent material consists of LED fluorescent powder with the specific gravity greater than that of encapsulating glue, and light microspheres with the specific gravity less than that of the encapsulating glue, and can be used for substituting the fluorescent powder in a white-light LED. In the curing process after white-light LED dispensing, the fluorescent powder settles in the encapsulating glue to enable a color temperature of the white-light LED to be reduced, and the light microspheres upwards float to rise the color temperature, so that influences on the color temperature due to the fluorescent powder settling are balanced out. According to the fluorescent material disclosed by the invention, the light microspheres with the proper grain size and specific gravity are selected to be mixed with the fluorescent powder, so that a color temperature deviation problem caused by the fluorescent powder settling in the white-light LED encapsulating process can be eliminated, the yield of the white-light LED is increased, and the light color uniformity of the white-light LED can be improved.

Description

technical field [0001] The invention belongs to the technical field of optoelectronics and relates to fluorescent materials for white light LEDs. Background technique [0002] The current common white light LED technology is to use the blue light generated by the chip to excite phosphor powder to emit green, yellow or red light, which is matched with the blue light of the LED chip to produce white light. Phosphor powder is generally coated on the blue LED chip by dispensing process. [0003] In the production process of white light LEDs, the consistency of light color is an important indicator to measure the quality of products. Factors such as phosphor concentration, dispensing amount, dispensing process, and curing process will affect the light color consistency of white LEDs, resulting in color temperature deviations of white LED products, thereby affecting the yield. Among them, due to the large specific gravity of phosphor powder, sedimentation will occur during the c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/58H01L33/52
Inventor 董岩贾龙昌宋立
Owner SOUTHEAST UNIV
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