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Connection structure and connection method of chip

A connection structure and connection method technology, applied in the field of electrical connection, can solve problems such as high product cost, unqualified products, and reduced yield, and achieve the effects of improving yield, preventing oxidation and corrosion, and reducing area

Inactive Publication Date: 2014-03-19
WUHU GRAND VISION AUTO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The distance between the two chips is large, and two bonding wires 4 need to be connected. There are many process steps, and mistakes in each operation will lead to unqualified products, lower yields, time-consuming and material-consuming, and high product costs.

Method used

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  • Connection structure and connection method of chip
  • Connection structure and connection method of chip

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Embodiment Construction

[0020] The specific implementation manner of the present invention will be described in further detail below by describing the embodiments with reference to the accompanying drawings.

[0021] In order to solve the problems existing in the chip connection structure in the prior art, the technical solution adopted by the present invention is: the chip a2 and the chip b3 are bonded and connected through the bonding wire 4 .

[0022] Such as figure 1 As shown, it is the chip connection structure of the present invention, the chip a2 and the chip b3 are fixed on the circuit board 1, and one end of the bonding wire 4 is pressure-welded to the lead terminal on the electrode surface of the chip a2 through the wire feeding end of the bonding machine to form the second A bonding point is then moved to the position corresponding to the other chip b3 for pressure welding to complete the connection process of the bonding wire 4 .

[0023] Preferably, the bonding wire 4 is a gold wire or...

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PUM

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Abstract

The invention discloses a connection structure and a connection method of a chip. The connection structure comprises a circuit board (1), and a chip a (2) and a chip b (3) which are fixed on the circuit board (1). Lead-wire points are evenly arranged on electrode surfaces of the chip a (2) and the chip b (3). The connection structure is characterized in that: the lead-wire points between the chip a (2) and the chip b (3) are connected in a binding way via binding wires (4). With application of the aforementioned technical scheme, the corresponding lead-wire points between the chips are directly connected via the binding wires. Compared with an existing technology, processing step is simplified and the chips can be closely arranged between each other so that the connection structure is compact in structure, and area of the circuit board is reduced, cost is lowered and product yield rate is enhanced.

Description

technical field [0001] The present invention relates to the technical field of electrical connection, and more specifically, the present invention relates to a chip connection structure and a connection method. Background technique [0002] At present, the widely used SMT chip technology is to solder the pins of the chip on the circuit board. In the package test, there are problems such as virtual soldering, false soldering, and missing soldering. Exposure to the air is affected by natural and human factors, causing the product to be prone to short circuit, open circuit, or even burnt. [0003] The existing bonded chip technology is to connect the internal circuit of the chip with the package pin of the circuit board through the bonding wire, and then cover it with organic materials with special protection functions to complete the post-package. The advantage of this method is that it is made The product stability is much higher than the traditional SMT placement method. B...

Claims

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Application Information

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IPC IPC(8): H01L23/49H01L21/603
CPCH01L2224/48137H01L2224/48472H01L2224/48091H01L2924/00014H01L2924/00
Inventor 朱宗恒孙广
Owner WUHU GRAND VISION AUTO ELECTRONICS CO LTD
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