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Mask plate and manufacturing method thereof

A manufacturing method and mask technology, which are applied in the directions of ion implantation plating, metal material coating process, coating, etc., can solve the problems of multiple processes and complicated processes of the mask, and achieve a simple manufacturing process and a simplified process flow. , to avoid the effect of the process of drawing and welding

Active Publication Date: 2016-04-06
TRULY SEMICON
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, the inventors found that the process of forming the mask plate in the prior art requires many processes, and the process is cumbersome.

Method used

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  • Mask plate and manufacturing method thereof
  • Mask plate and manufacturing method thereof
  • Mask plate and manufacturing method thereof

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Embodiment Construction

[0033] As mentioned in the background art section, the manufacturing method of the mask plate in the prior art uses many processes, and the processes are cumbersome.

[0034] The inventors have found that the reason for the above phenomenon is that in the prior art mask making process, the mask frame and the mask need to be made separately first, and finally the mask and the mask made by pulling the net and welding process The frame is fastened together. Since a variety of processes are involved in the manufacturing process, such as a netting process and a welding process, and the process of each process is relatively complicated, the manufacturing process of the mask plate in the prior art is cumbersome.

[0035] Based on this, the inventor found through research that a method for making a mask plate includes the following steps:

[0036] S1: Provide the substrate;

[0037] S2: thinning the central region of the substrate to form a mask region, and forming a mask frame in t...

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Abstract

The invention provides a mask plate manufacturing method and a mask plate manufactured by adopting the method. The mask plate manufacturing method comprises the following steps of providing a substrate; thinning the middle area of the substrate to form a mask area, and enabling an area which is not thinned to form a mask frame; etching an area where a mask pattern block is to be formed in the mask area to form mask through holes and mask lines. As the integral substrate is adopted by the mask plate manufacturing method provided by the invention, the mask frame and a mask are formed simultaneously through multiple thinning and etching. As the mask frame and the mask are of an integral structure, the mask frame and the mask do not need to be fixed through the hauling and welding process, and therefore, the process flow of the mask plate is simplified, so that the mask plate manufacturing process is simpler. Furthermore, as the mask plate provided by the invention is manufactured by adopting the method, damage to the mask through holes during the hauling and welding process is avoided, and therefore, the quality of the mask plate can be improved.

Description

technical field [0001] The invention relates to the technical field of vapor deposition, and more specifically relates to a mask plate and a manufacturing method thereof. Background technique [0002] Organic electroluminescent devices (OLEDs) are considered to be the next generation of flat panel display devices due to their advantages such as low cost, high brightness, high contrast, fast response, low power consumption, wide viewing angle, thin appearance, and flexible display. Liquid crystal displays (LCDs) at this stage. OLEDs have an anode, an organic light-emitting layer, and a cathode sequentially stacked on a glass substrate. Materials for the organic light-emitting layer are generally classified into macromolecular organic materials and small molecular organic materials. For small molecule organic materials, vacuum evaporation is usually used to form various organic functional layers on the anode, and finally the cathode of the device is formed. [0003] In OLED...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/04
Inventor 谢志生丁涛苏君海柯贤军何基强李建华
Owner TRULY SEMICON