Capacitor containing heat conducting and insulating film

A technology of heat conduction insulation and capacitors, which is applied in the field of capacitors, can solve the problems of circuit or equipment miniaturization of unfavorable cake capacitors, shorten the service life of capacitors, increase the installation space of capacitors, etc. Material saving effect

Inactive Publication Date: 2014-03-26
TONGLING YUANFENG ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] When the capacity of the capacitor is large, the heating power of the capacitor is also large, and the overheating of the capacitor will easily lead to aging of the electrodes and shorten the service life of the capacitor
In order to reduce the volume of the product and reduce the installation space of the film capacitor, the film capacitor is usually made into a cylindrical or cake shape after winding the film. For example, most of the resonant plastic case capacitors are cake-shaped, and the cake-shaped capacitor has better heat dissipation performance. Because the distance between the round surfaces on both sides of the pie-shaped capacitor is relatively close, it is beneficial for the rolled film core to dissipate heat in the axial direction. Therefore, for general large-capacity pie-shaped capacitors, the area of ​​the capacitor film is mainly increased by increasing the diameter. However, increasing the diameter of the pie capacitor also increases the installation space of the capacitor, which is not conducive to the miniaturization of the circuit or equipment using the pie capacitor

Method used

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  • Capacitor containing heat conducting and insulating film
  • Capacitor containing heat conducting and insulating film
  • Capacitor containing heat conducting and insulating film

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Embodiment Construction

[0016] The content of the present invention will be described below in conjunction with specific embodiments.

[0017] Such as Figure 1 to Figure 4 Shown is a schematic structural diagram of a capacitor containing a thermally conductive insulating film according to the present invention. A capacitor containing a thermally conductive insulating film according to the present invention includes: a conductive film 1 and a thermally conductive insulating film 2, and also includes a casing 3 and a casing cover 4, and the casing 3 includes an annular side wall 31, a tubular inner wall 32 and a tubular outer wall 33 , the film core is located in the shell 3 and the film core is coaxial with the shell 3, the shell cover 4 is annular and covers the annular opening 34 of the shell 3; the conductive The film 1 includes an insulating medium layer 11 and conductive layers 12 located on both sides of the insulating medium layer 11. The conductive film 1 and the thermally conductive insulat...

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Abstract

The invention discloses a capacitor containing a heat conducting and insulating film. The capacitor comprises a conductive thin film and the heat conducting and insulating film. The conductive thin film comprises an insulating dielectric layer and conductive layers arranged on the two faces of the insulating dielectric layer, and a cylindrical thin film core is formed by stacking and winding the conductive thin film and the heat conducting and insulating film. According to the capacitor containing the heat conducting and insulating film, the conductive thin film can be processed through the two-layer metal film plating method, materials are saved, and processing is easy; due to the fact that the heat conducting and insulating film is arranged, on the one hand, the insulating purpose can be achieved, on the other hand, the heat dissipation performance of the thin film core can be improved, and therefore negative influences caused by the excessively-large axial length of a pie-shaped capacitor on the heat dissipation performance are overcome. Meanwhile, heat conducting silica gel is preferentially selected as the heat conducting and insulating film according to the cost and the heat conducting and insulating performance.

Description

technical field [0001] The invention relates to a capacitor containing a thermally conductive insulating film, belonging to the technical field of capacitor production. Background technique [0002] When the capacity of the capacitor is large, the heating power of the capacitor is also large, and overheating of the capacitor can easily lead to electrode aging and shorten the service life of the capacitor. In order to reduce the volume of the product and reduce the installation space of the film capacitor, the film capacitor is usually made into a cylindrical or cake shape after winding the film. For example, most of the resonant plastic case capacitors are cake-shaped, and the cake-shaped capacitor has better heat dissipation performance. Because the distance between the round surfaces on both sides of the pie-shaped capacitor is relatively close, it is beneficial for the rolled film core to dissipate heat in the axial direction. Therefore, for general large-capacity pie-sha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/002H01G4/005H01G4/06H01G4/224H01G4/32H01G4/33
Inventor 汪秀义
Owner TONGLING YUANFENG ELECTRONICS
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