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Electrostatic chuck

An electrostatic chuck and electrode layer technology, which is applied in the direction of holding devices, circuits, and electrical components that apply electrostatic attraction, can solve problems such as peeling, reduced internal electrode conductivity, and weak adhesion, so as to improve adhesion, The effect of improving the conductivity

Active Publication Date: 2017-11-10
TOTO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, when using a printed circuit board of high-purity alumina to produce an electrostatic chuck with an internal electrode structure, the adhesion between the internal electrode layer and the high-purity alumina layer above and below is weak, and the high-purity alumina layer and the high-purity alumina layer are separated during processing. The interface of the internal electrode layer is prone to peeling
Therefore, in order to enhance the adhesion, there is a method of adding aluminum oxide to the internal electrode layer as the same material, but in this case, there is a problem that the conductivity of the internal electrode decreases due to the addition of aluminum oxide.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0139] Example 1 is an example in which Pd is 50% by volume and alumina is 50% by volume. There is no problem with firing and grinding, and there is sufficient adhesion of the internal electrode layer. In addition, it has sufficient conductivity of the internal electrode layer when used in an electrostatic chuck.

[0140] Figure 5 is a diagram illustrating an electrode layer.

[0141] Figure 5 A cross-sectional SEM image of the electrode layer 12 after firing is shown. Figure 5 The middle white part is Pd.

[0142] Such as Figure 5 As shown, the electrode layer 12 has no gaps and is dense, and the Pd particles are also closely attached to each other and continuous. Therefore, the electrical conductivity is also good, and the adhesion between the electrode layer 12 and the high-purity alumina layers (first dielectric layer 111 and second dielectric layer 112 ) above and below it is also in a good state.

[0143] In addition, since high-purity alumina and electrode ra...

Embodiment 2

[0144] Example 2 is an example in which Pd is 30% by volume and alumina is 70% by volume. Although the electrode layer 12 does not have conductivity after firing, sufficient conductivity for use in an electrostatic chuck can be secured by HIP treatment. In addition, there is no problem in firing and grinding, and sufficient adhesion force of the electrode layer 12 is exhibited.

[0145] Plasma Resistance Evaluation

[0146] Regarding the decrease in surface roughness (durability) of the alumina sintered body caused by plasma irradiation, a plasma irradiation test and evaluation were performed using the following samples. As test samples used, a part of the electrostatic chuck produced in Examples 1 and 2 was cut out, and the surface thereof was ground to a surface roughness of Ra of 0.03 μm or less. Plasma was irradiated to this test sample, and the change of surface roughness Ra was measured. Plasma irradiation was carried out at 1000W for 30 hours using a reactive ion etc...

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Abstract

The present invention provides an electrostatic chuck capable of improving the adhesion between an internal electrode layer and a ceramic dielectric substrate and improving the conductivity of the internal electrode layer. Specifically, it is characterized in that it includes: a ceramic dielectric substrate, which is a polycrystalline ceramic sintered body, and has a first main surface on which the object to be processed is placed and a second main surface opposite to the first main surface; and an electrode layer. , built between the first main surface and the second main surface of the ceramic dielectric substrate, and integrally sintered on the ceramic dielectric substrate, the ceramic dielectric substrate has: the first dielectric layer, which is located between the electrode layer and the first Between the main surfaces; and the second dielectric layer, located between the electrode layer and the second main surface, the electrode layer has: a first part, which has conductivity; and a second part, which connects the first dielectric layer and the second dielectric layer The vias are combined, and the average grain size of the crystals contained in the second portion is smaller than the average grain diameter of the crystals contained in the ceramic dielectric substrate.

Description

technical field [0001] The present invention relates to an electrostatic chuck, and more specifically, to an electrostatic chuck capable of maintaining an object to be treated by adsorption and holding at a desired temperature. Background technique [0002] In the plasma processing chamber for etching, chemical vapor deposition (CVD (Chemical Vapor Deposition)), sputtering (sputtering), ion implantation, ashing, etc., as an adsorption and holding object to be processed such as semiconductor wafers or glass substrates The unit uses an electrostatic chuck. [0003] The production method of the electrostatic chuck includes: firing a plate-shaped ceramic dielectric substrate, forming an electrode on one side of it by CVD or sputtering (single plate structure); and making a ceramic printed circuit by thin plate forming method substrate, and a method of laminating a plurality of printed circuit boards above and below a printed circuit board on which electrodes are printed (intern...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683
CPCH01L21/6833H01L21/68757B23Q3/15C04B35/053H01L21/683H02N13/00
Inventor 穴田和辉和田琢真
Owner TOTO LTD
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