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LED (Light-Emitting Diode) package structure and package method

An LED packaging and chip technology, applied in electrical components, electrical solid-state devices, circuits, etc., can solve the problems of large secondary optical design limitations, poor spot consistency, low light utilization rate of LED chips, etc., to improve luminous efficiency and The uniformity of the light spot, the simple and practical packaging method, and the effect of saving the amount of fluorescent glue

Inactive Publication Date: 2014-03-26
东莞市港照照明科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above-mentioned structure has the following problems: 1. The utilization rate of light emitted by the LED chip is low; 2. The amount of fluorescent powder is large; 3. The consistency of the light spot is poor;

Method used

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  • LED (Light-Emitting Diode) package structure and package method
  • LED (Light-Emitting Diode) package structure and package method
  • LED (Light-Emitting Diode) package structure and package method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Example 1, Such as Figure 2~4 As shown, an LED packaging structure includes a bracket 1, an LED chip 2, fluorescent glue 3, a lens 4, a substrate 5 and an electrode 6, the substrate 5 and the electrode 6 are respectively arranged on the bracket 1, and the LED chip 2 is fixedly arranged on the substrate 5 and It is electrically connected with the electrode 6, and the surrounding of the LED chip 2 is provided with a fully surrounded first enclosure 7, the fluorescent glue 3 is coated on the surface of the LED chip 2, the bracket 1 is provided with a second enclosure 9, and the lens 4 passes through the second enclosure. The flow-blocking forming cover of the file 9 is connected to the bracket 1, and the second enclosure 9 is mainly used for blocking the flow when the lens 4 is connected, and the lens 4 is set to a transparent arc structure, which improves the luminous efficiency of the LED chip 2 and Spot uniformity. When the fluorescent glue 3 is coated on the surfac...

Embodiment 2

[0022] Example 2, Such as Figure 5 As shown, the difference from Embodiment 1 is that the electrode 6 of this embodiment includes a positive electrode and a negative electrode, and the positive electrode and the negative electrode are respectively arranged on the substrate 5, and both the positive electrode and the negative electrode are electrically connected to the LED chip 2 through the gold wire 8. connect.

[0023] Other structures are the same as those in Embodiment 1, and will not be repeated here.

Embodiment 3

[0024] Example 3, A packaging method for implementing the LED packaging structure of Embodiment 1 and Embodiment 2, comprising the following steps: the first step, the electrode 5 is arranged on the bottom of the bracket 1, and then a fully enclosed first enclosure 7 is arranged on the substrate 5; In the second step, the LED chip 2 is fixed in the first enclosure 7, the LED chip 2 is electrically connected to the electrode 5, and the fluorescent glue 3 is evenly coated on the LED chip 2 in the first enclosure 7 by a glue dispenser. surface; then the lens 4 is connected to the bracket 1 through the flow blocking molding of the second enclosure 9 .

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Abstract

The invention belongs to the technical field of package of semiconductor light source LED (Light-Emitting Diode), and in particular relates to an LED package structure, which comprises a rack, an LED wafer, fluorescent gel, a lens, a substrate and an electrode, wherein the substrate and the electrode are respectively arranged on the rack, the LED wafer is fixedly arranged on the substrate and connected with the electrode, a first fence is arranged around the LED wafer in an completely encapsulating way the surface of the LED wafer is covered with the fluorescent gel, the rack is provided with a second fence, and the lens is molded and covered on the rack though the choking of the second fence. Consumption of the fluorescent gel covering on the surface of the LED wafer is reduced due to the arrangement of the first fence, the LED wafer excites white light through the fluorescent gel, and the lens is shaped by the choking of the second fence, and thus the LED lighting effect is enhanced, light emitting angle is improved, and light spots are uniform; compared with LED with similar structure in prior art, the LED package structure needs less production devices, and is greatly improved in yield and automation and lowered in cost. Furthermore, the invention further discloses an LED package method.

Description

technical field [0001] The invention belongs to the technical field of semiconductor light source LED packaging, and in particular relates to an LED packaging structure and a packaging method thereof. Background technique [0002] The LED industry is one of the industries that has attracted the most attention in recent years. Up to now, LED products have the advantages of energy saving, power saving, high efficiency, fast response time, long life cycle, mercury-free, and environmental protection benefits. However, more and more attention has been paid to the technical improvement of LED packaging, such as figure 1 As shown, the existing LED package structure includes a base material 11 , an LED chip 12 , wires 13 and encapsulant 14 . The LED chip 12 is fixed on the base material 11 , the LED chip 12 is connected and conducted through the wire 13 , and the encapsulation glue 14 covers the LED chip 12 and fills the holder plastic cup. The above-mentioned structure has the fo...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/54H01L33/50H01L33/58
CPCH01L2224/48465H01L2224/49113H01L2224/8592H01L33/483H01L33/005H01L33/58
Inventor 安庆有刘明剑
Owner 东莞市港照照明科技有限公司
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