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A kind of halogen-free anti-aging epoxy resin composition and the method for preparing covering film with the resin composition

A technology of epoxy resin and composition, applied in chemical instruments and methods, synthetic resin layered products, coatings, etc., can solve the problems of poor long-term aging resistance, fracture, easy cross-linking of unsaturated double bonds, etc. Effects of long-term aging resistance

Inactive Publication Date: 2016-03-09
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, it has been found in practice that although the covering film prepared by the epoxy adhesive system of rubber-toughened epoxy resin has good overall performance, it also has the defect of poor long-term aging resistance. The main reason is that the rubber molecular chain contains a large amount of During the use of the covering film, the unsaturated double bond is easy to cross-link or break, resulting in poor long-term aging resistance of the covering film

Method used

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  • A kind of halogen-free anti-aging epoxy resin composition and the method for preparing covering film with the resin composition
  • A kind of halogen-free anti-aging epoxy resin composition and the method for preparing covering film with the resin composition

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Embodiment 1

[0028]A halogen-free aging-resistant epoxy resin composition, including the following components by weight: phosphorus-containing epoxy resin (product model G-24, epoxy equivalent 340g / eq, phosphorus content 2.4% by mass, Jiangshan Jianghuan Chemical Industry Co., Ltd.) 39 parts by weight; aliphatic amino-terminated polyether D-2000 (manufactured by Huntsman Chemical Co.) 20 parts by weight; rubber-modified epoxy resin (product model EponResin58005, elastomer content 40% by weight, Manufactured by Hexion Specialty Chemicals, Inc.) 13 parts by weight; phosphorus-containing phenolic resin (product model XZ92741, phosphorus content 9% by mass, manufactured by Dow Chemical Company) 28 parts by weight; diaminodiphenyl sulfone 2.5 parts by weight; 1-cyanoethyl-2 ethyl 0.3 parts by weight of base-4 methylimidazole (2E4MZ-CN); 30.0 parts by weight of aluminum hydroxide (average particle size 1 to 5 μm, purity 99% or more); 0.20 parts by weight of antioxidant (commercial model 1010, man...

Embodiment 2

[0031] A halogen-free aging-resistant epoxy resin composition, including the following components by weight: phosphorus-containing epoxy resin (product model G-24, epoxy equivalent 340g / eq, phosphorus content 2.4% by mass, Jiangshan Jianghuan Chemical Industry Co., Ltd.) 39 parts by weight; aliphatic amino-terminated polyether D-2000 (molecular weight 2000, linear bifunctional amino polyether, manufactured by Huntsman Chemical Company) 15 parts by weight; amino-terminated polyether T-5000 ( Molecular weight 5000, trifunctional amino polyether, manufactured by Huntsman Chemical Company) 5 parts by weight; rubber modified epoxy resin (product model EponResin58005, elastomer content 40% by weight, manufactured by Hexion Specialty Chemicals, Inc.) 13 parts by weight; Phosphorus-containing phenolic resin (product model XZ92741, phosphorus content 9% by mass, manufactured by Dow Chemical Company) 28 parts by weight; diaminodiphenylsulfone 2.5 parts by weight; 1-cyanoethyl-2ethyl-4 me...

Embodiment 3

[0034] A halogen-free aging-resistant epoxy resin composition, including the following components by weight: phosphorus-containing epoxy resin (product model G-24, epoxy equivalent 340g / eq, phosphorus content 2.4% by mass, Jiangshan Jianghuan Chemical Industry Co., Ltd.) 39 parts by weight; aliphatic amino-terminated polyether D-2000 (molecular weight 2000, linear bifunctional amino polyether, manufactured by Huntsman Chemical Company) 10 parts by weight; amino-terminated polyether T-5000 ( Molecular weight 5000, trifunctional amino polyether, manufactured by Huntsman Chemical Company) 10 parts by weight; rubber modified epoxy resin (product model EponResin58005, elastomer content 40% by weight, manufactured by Hexion Specialty Chemicals, Inc.) 13 parts by weight; Phosphorus-containing phenolic resin (product model XZ92741, phosphorus content 9% by mass, manufactured by Dow Chemical Company) 28 parts by weight; diaminodiphenylsulfone 2.5 parts by weight; 1-cyanoethyl-2ethyl-4 m...

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Abstract

The invention provides a halogen-free anti-aging epoxy resin composition which comprises the following components in parts by weight: (A) 5-25 parts of aliphatic amine-terminated polyether; (B) 30-60 parts of phosphorus-containing epoxy resin; (C) 10-25 parts of rubber modified epoxy resin; (D) 20-50 parts of composite curing agent; (E) 0.01-1.0 part of curing accelerator; (F) 0.01-1.0 part of antioxidant; (G) 0-100 parts of filler; and (H) organic solvent; and the solid components are dispersed in the organic solvent according to the proportion to obtain the halogen-free anti-aging epoxy resin composition with solid content of 30-40wt%. According to the halogen-free anti-aging epoxy resin composition, the high-molecular weight aliphatic amine-terminated polyether is used to replace a part of rubber, the content of double bonds in the cover film is remarkably reduced, and the anti-aging property of the cover film is improved; and meanwhile, the requirement on the flexibility of the cover film is met, and the requirement on the adhesive strength between the cover film and a polyimide film is also met.

Description

technical field [0001] The invention relates to the technical field of cover films, in particular to a halogen-free aging-resistant epoxy resin composition and a method for preparing a cover film with the resin composition. Background technique [0002] Flexible printed circuit boards have been widely used in consumer electronics products such as notebook computers, mobile phones, personal digital assistants and digital cameras. Flexible printed circuit boards should widely use cover film. The cover film can not only act as a solder mask, but also protect the flexible printed circuit board from dust, moisture, and chemicals and reduce the impact of stress during bending. [0003] At present, the adhesive systems used for cover films mainly include acrylic and epoxy adhesive systems. Among them, the epoxy glue system mainly adopts synthetic rubber toughened epoxy resin at present. Synthetic rubber is mostly acrylonitrile-butadiene copolymer, wherein acrylonitrile content i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L71/00C08L63/10C08L61/06C08K13/02C08K3/22C08K5/134C08K5/3445C08K5/41B29C41/52B32B27/06
Inventor 张翔宇刘生鹏周韶鸿茹敬宏梁立
Owner GUANGDONG SHENGYI SCI TECH
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