A heat sink, manufacturing method of the heat sink, and electronic equipment
A technology for heat dissipation devices and radiators, applied in the direction of cooling/ventilation/heating transformation, circuits, electrical components, etc., which can solve the problems of complex installation and maintenance procedures of heat pipe radiators 101, complex assembly processes, and complex manufacturing of heat pipe radiators 101, etc.
Active Publication Date: 2016-10-05
HUAWEI TECH CO LTD
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Problems solved by technology
However, the manufacture of the heat pipe radiator 101 using this arrangement is complicated, the technical process requirements are high, and the assembly process is complicated, thereby affecting the production efficiency of the product, and the cost is high, and the installation and installation of the heat pipe radiator 101 on the single board The maintenance process is relatively complicated, and the cost of production and installation is relatively high, which does not meet the requirements of modern production technology for cost control
Method used
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Embodiment Construction
[0045] An embodiment of the present invention provides a heat dissipation device. The heat dissipation device adopts the air duct isolation technology, so that the power consumption device and the heat sensitive device can dissipate heat through independent air ducts, thereby effectively avoiding thermal cascading phenomenon.
[0046] The following combination figure 2 The heat dissipation device provided by the embodiment of the present invention is described in detail as shown:
[0047] The invention consists of figure 2 It can be seen that the heat dissipation device includes a single board 201 , a heat sink 204 for thermally sensitive components, and an air guide cover 203 .
[0048] The following combination image 3 The specific structure of the single board 201 is described as follows:
[0049] Depend on image 3 As can be seen from the illustration, the board 201 is provided with a heat sensitive device 302 and a power consumption device 303 , and the heat sensit...
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The embodiment of the invention discloses a heat-radiating device, a heat-radiating device manufacturing method and an electronic device. The heat-radiating device comprises that: a single board is provided with a heat-sensitive device and power consumption devices, and the position, which is corresponding to the heat-sensitive device, of the single board is provided with a heat-sensitive device heat radiator; two ends of the heat-sensitive device heat radiator extend upwardly so that heat-radiating fins are formed, and the heat-radiating fins are arranged along direction of forced air cooling airflow on the single board so that heat of the heat-sensitive device is radiated via the heat-radiating fins; and wind scoopers are arranged among the heat-radiating fins on the two ends of the heat-sensitive device heat radiator and corresponding to the power consumption devices so that the wind scoopers can be arranged along the direction of forced air cooling airflow on the single board, and heat of the power consumption devices can be radiated via the wind scoopers. The heat-sensitive device is not influenced by heat radiated by the power consumption devices so that influence of cascaded heat of high-power devices can be avoided.
Description
technical field [0001] The invention relates to the technical field of heat dissipation of electronic devices, in particular to a heat dissipation device, a manufacturing method of the heat dissipation device and electronic equipment. Background technique [0002] With the continuous development of electronic technology, the operating frequency and integration level of electronic chips on circuit boards of electronic equipment are also getting higher and higher, and the heat generation of electronic chips is also increasing. The generation of a large amount of heat will continuously increase the temperature of the electronic chip, and excessive temperature will seriously affect the performance of the electronic chip, and then affect the performance of the circuit board carrying the electronic chip and the electronic equipment system. [0003] In a large power consumption board with thermally sensitive devices, in order to improve the heat dissipation performance, the chip ca...
Claims
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IPC IPC(8): H01L23/34H05K7/20
Inventor 曲中江
Owner HUAWEI TECH CO LTD