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Wiring board and manufacturing method thereof

A manufacturing method and wiring board technology, applied in printed circuit manufacturing, multi-layer circuit manufacturing, conductive pattern layout details, etc., can solve the problems of damaged insulation reliability, easy damage, difficult resolution, etc., and achieve high reliability Effect

Active Publication Date: 2017-01-04
IBIDEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Therefore, in the structure in which electronic components are embedded in the insulating layer, it is necessary to form small via holes in the insulating layer with a size commensurate with the wiring with a pitch of 40 to 50 μm. relationship is difficult
[0010] In addition, in order to form via holes by photolithography, it is necessary to use a developing solution to remove the resist unnecessary for pattern formation, and it is considered that the insulating reliability between wirings is impaired by the developing solution.
[0011] Furthermore, since such electronic components are as thin as about 20 μm, they may be easily damaged by laser light.

Method used

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  • Wiring board and manufacturing method thereof
  • Wiring board and manufacturing method thereof
  • Wiring board and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach ＞

[0073] Wiring board 100 of this embodiment is, for example, Figure 1A , Figure 1B multilayer printed wiring board shown. Wiring board 100 of the present embodiment is a multilayer laminated wiring board having a buildup of core substrates. However, the wiring board of the present invention is not limited to a multilayer laminated wiring board having a core substrate, and may be, for example, a double-sided rigid wiring board, a flexible wiring board, or a flexible-rigid wiring board. In addition, in the wiring board 100 , the dimensions, the number of layers, and the like of the conductor layer and the insulating layer can be arbitrarily changed within the scope of the technical idea of ​​the present invention.

[0074] Such as Figure 1A , Figure 1B , figure 2 As shown, a microprocessor MPU (Micro-Processing Unit) 50 as a first semiconductor element and a DRAM (Dynamic Random Access Memory) 51 as a second semiconductor element are installed and arranged on a wiring boa...

Deformed example 1

[0139] In the above-described embodiment, MPU 50 and DRAM 51 are connected using one wiring structure 1 . In contrast, in this modified example, if Figure 8 In the wiring board 103 shown, two (plural) wiring structures 10 are used, and the MPU 50 and the two DRAMs 51 b and 51 c are connected through the wiring structures 10 . Other than that, since it is the same as the above-mentioned embodiment, corresponding parts are assigned corresponding symbols and detailed description thereof will be omitted.

[0140] By adopting the above-mentioned connection system, the reliability of the electrical connection between the MPU 50 and the two DRAMs 51b and 51c is improved compared to the case where only a single wiring structure 10 is used. That is, for example, a dedicated wiring structure 10 corresponding to the characteristics (wiring pitch, wiring width, etc.) of the DRAMs 51 b and 51 c can be used, and the accuracy of electrical connection can be improved. As a result, the perf...

Deformed example 2

[0142] In the above-described embodiments, the conductor pattern 111 of the wiring structure 10 is used for signal transmission between the MPU 50 and the DRAM 51 . In contrast, in this modified example, if Figure 9 As shown, the conductor pattern 111 of the wiring structure 10 is used for signal transmission within a single IC chip 61 . Other configurations and dimensions of each component are the same as those in the above-mentioned embodiment.

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Abstract

The present invention provides a wiring board with high reliability and a manufacturing method thereof. The wiring board (100) has: an interlayer insulating layer (39a); a conductor layer (37c) formed on the interlayer insulating layer (39a); a solder resist layer (40a) provided on the interlayer insulating layer (39a) an opening (40d), which penetrates the solder resist layer (40a); an opening (40c), which is formed on the solder resist layer (40a); and a wiring structure (10), which is disposed on the opening ( 40c), with an insulating layer (120) and a conductor pattern (111) on the insulating layer (120). The pattern width of the conductor pattern (111) is smaller than the pattern width of the conductor pattern formed on the conductor layer (37c).

Description

technical field [0001] The present invention relates to a wiring board and its manufacturing method, in particular, to a wiring board partially having high-density wiring and its manufacturing method. Background technique [0002] As a multilayer printed wiring board for mounting IC chips (semiconductor elements), there is known a wiring board in which interlayer insulating layers and conductor layers are alternately laminated on a resinous core substrate having via-hole conductors. The hole conductor connects the conductor layers. [0003] With recent miniaturization and high integration of IC chips, the number of pads formed on the uppermost layer of a package substrate has increased. As the number of such pads increases, the pitch of the pads is miniaturized (40 to 50 μm pitch) is advancing. Along with the miniaturization of the pitch of such pads, the wiring pitch of the package substrate is also rapidly miniaturized (for example, refer to Patent Document 1). [0004]...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/11H05K3/32H05K3/46
CPCH01L24/14H01L2224/16225H01L2224/32225H01L2224/73204H01L2924/15311H05K3/3436H05K3/4007H05K3/4694H05K2201/10159H01L2924/12042H01L2924/15192H05K3/4644H01L2924/00H05K1/0298H01L24/18
Inventor 闲野义则照井诚国枝雅敏苅谷隆
Owner IBIDEN CO LTD