Micromechanical sensor with three-layer substrate

A technology of micromechanical sensors and substrates, which is applied in scientific instruments, measuring devices, meteorology, etc., can solve the problems of incompatibility of production process microelectronics process, difficulty in large-scale use, and measurement impact, so as to achieve easy control of process quality and low cost. Low, volume-reducing effect

Inactive Publication Date: 2016-03-02
NANJING UNIV OF INFORMATION SCI & TECH
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this raindrop spectrometer is expensive, difficult to use on a large scale, and its production process is not compatible with microelectronics processes
Instruments based on optical principles are also easily affected by the surrounding environment, such as dust blocking the lens, which will affect the measurement

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Micromechanical sensor with three-layer substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] Below in conjunction with accompanying drawing, the technical scheme of invention is described in detail:

[0020] Such as figure 1 The shown micromechanical sensor with a three-layer substrate includes: a first substrate 101 made of a single crystal silicon wafer, a second substrate 201, and a third substrate 301, and the third substrate 301 is a micromechanical sensor with a three-layer substrate. The base, the second substrate 201 is placed on the third substrate 301 and connected to the third substrate 301 , the first substrate 101 is placed on the second substrate 201 and connected to the second substrate 201 .

[0021] The first substrate 101 is processed by a MEMS process to obtain a first cavity 103 with an opening downward and a first membrane 102 .

[0022] The second substrate 201 is opened with a first through hole 202 , and the first through hole 202 communicates with the first cavity 103 .

[0023] The third substrate 301 is processed by the MEMS process...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a micro mechanical sensor with three layers of base plates, and belongs to the technical field of micro mechanical sensors. The sensor comprises the three layers of base plates made of monocrystalline silicon wafers, the three layers of base plates and a cavity structure are utilized for forming a unique path for gas circulation. The micro mechanical sensor has the advantages that an MEMS (micro-electromechanical system) processing process is adopted, the size of the sensor is reduced, and the micro mechanical sensor can be used for measuring precipitation particles.

Description

technical field [0001] The invention discloses a micromechanical sensor with a three-layer substrate, which belongs to the technical field of micromechanical sensors. Background technique [0002] Measuring precipitation is an important part of meteorological measurements. Traditional methods of measuring precipitation mainly use tipping bucket or cylinder rain gauges. However, there is a wetting error in the traditional rain gauge. When there are only a few precipitation particles, the wetting error may make the instrument unable to detect the precipitation particles. At the same time, traditional rain gauges cannot measure the mass of raindrops, nor can they distinguish raindrops from hail. [0003] The current raindrop spectrometer based on the principle of optical scattering can measure the quality of raindrops and avoid infiltration errors. However, this raindrop spectrometer is expensive, difficult to use on a large scale, and its production process is not compatibl...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): G01W1/14
Inventor 刘清惓李海涛韩上邦杨龙
Owner NANJING UNIV OF INFORMATION SCI & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap