Micromechanical sensor with three-layer substrate
A technology of micromechanical sensors and substrates, which is applied in scientific instruments, measuring devices, meteorology, etc., can solve the problems of incompatibility of production process microelectronics process, difficulty in large-scale use, and measurement impact, so as to achieve easy control of process quality and low cost. Low, volume-reducing effect
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[0019] Below in conjunction with accompanying drawing, the technical scheme of invention is described in detail:
[0020] Such as figure 1 The shown micromechanical sensor with a three-layer substrate includes: a first substrate 101 made of a single crystal silicon wafer, a second substrate 201, and a third substrate 301, and the third substrate 301 is a micromechanical sensor with a three-layer substrate. The base, the second substrate 201 is placed on the third substrate 301 and connected to the third substrate 301 , the first substrate 101 is placed on the second substrate 201 and connected to the second substrate 201 .
[0021] The first substrate 101 is processed by a MEMS process to obtain a first cavity 103 with an opening downward and a first membrane 102 .
[0022] The second substrate 201 is opened with a first through hole 202 , and the first through hole 202 communicates with the first cavity 103 .
[0023] The third substrate 301 is processed by the MEMS process...
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