Electroplating tank
A technology of electroplating tank and electroplating solution, which is applied in the direction of plating tanks, circuits, electrical components, etc., can solve the problems of difficult control of uniformity, and achieve the effects of consistent surface loss, extended length, and reduced quantity
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[0073] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0074] The implementation of the present invention will be described in detail below in conjunction with specific drawings.
[0075] Such as Figure 2-4a Shown is the preferred embodiment provided by the present invention.
[0076] An electroplating tank provided in this embodiment is a working tank where electroplating occurs, and is used to deposit copper or gallium or indium or selenium on a surface of a substrate. It can be understood that the substrate is conducive to depositing copper or gallium or The indium or selenium element absorbing layer is made of conductive material, such as alumin...
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