Pulse plating method of Ag-Ni alloy for electric contact material
An electrical contact material and pulse electroplating technology, which is applied in the field of preparation technology of electrical contact materials, can solve the problem of no electroplating Ag-Ni alloy, etc., and achieve the effects of good wear resistance and high hardness of the coating layer.
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Embodiment 1
[0027] A kind of pulse electroplating method of Ag-Ni alloy for electric contact material, comprises the following steps:
[0028] Sanding, water washing surfactant degreasing, water washing, activation, water washing, pulse plating, water washing, drying.
[0029] Among them, the substrate is made of pure copper;
[0030] Among them, the activation uses 250ml / L H 2 SO 4 solution, at room temperature for 1 to 2 minutes;
[0031] Among them, the composition of the electroplating solution is: 0.3mol / L NiSO 4 ·6H 2 O, 0.03mol / L AgCH 3 SO 3 , 1.5mol / L KI, 20g / L H 3 BO 3 , 10g / L H 2 NCONH 2 .
[0032] Wherein, the pulse electroplating parameters are: frequency 700Hz, duty cycle 20%, double pulse ratio 13:1, current density 0.4A / dm2, temperature 340°C.
Embodiment 2
[0034] A kind of pulse electroplating method of Ag-Ni alloy for electric contact material, comprises the following steps:
[0035] Sanding, water washing surfactant degreasing, water washing, activation, water washing, pulse plating, water washing, drying.
[0036] Among them, the substrate is made of pure copper;
[0037] Among them, the activation uses 250ml / L H 2 SO 4 solution, at room temperature for 1 to 2 minutes;
[0038] Among them, the composition of the electroplating solution is: 0.4mol / L NiSO 4 ·6H 2 O, 0.03mol / L AgCH 3 SO 3 , 1.5mol / L KI, 20g / L H 3 BO 3 , 10g / L H 2 NCONH 2 .
[0039]Wherein, the pulse plating parameters are: frequency 700 Hz, duty cycle 20%, double pulse ratio 14:1, current density 0.5 A / dm2, temperature 30°C.
Embodiment 3
[0041] A kind of pulse electroplating method of Ag-Ni alloy for electric contact material, comprises the following steps:
[0042] Sanding, water washing surfactant degreasing, water washing, activation, water washing, pulse plating, water washing, drying.
[0043] Among them, the substrate is made of pure copper;
[0044] Among them, the activation uses 250ml / L H 2 SO 4 solution, at room temperature for 1 to 2 minutes;
[0045] Among them, the composition of the electroplating solution is: 0.5mol / L NiSO 4 ·6H 2 O, 0.03mol / L AgCH 3 SO 3 , 1.5mol / L KI, 20g / L H 3 BO 3 , 10g / L H 2 NCONH 2 .
[0046] Wherein, the pulse plating parameters are: frequency 700 Hz, duty cycle 20%, double pulse ratio 12:1, current density 0.6 A / dm2, temperature 40°C.
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