LED (light emitting diode) street lamp light source module with silicon substrates

A technology for LED street lamps and light source modules, which is applied in the direction of light sources, electric light sources, point light sources, etc. It can solve the problems of large thermal resistance and poor heat dissipation capacity, and achieve good heat dissipation performance, convenient research and development, and reduce thermal resistance.

Inactive Publication Date: 2014-05-28
JIANGSU XGL OPTOELECTRONICS
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  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

[0002] At present, most of the light sources used for LED street lamps are gold-wire-packaged light sources in the form of imitation lumens. The weakness of this type of light source lies in the use of gold-wire connection technology. The chip and the bracket must be fixed with silver glue. Form bracket is silver-plated plastic-coated iron or silver-plated plastic-coated copper, which has poor heat dissipation

Method used

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  • LED (light emitting diode) street lamp light source module with silicon substrates

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Embodiment Construction

[0009] The present invention will be further described below in conjunction with specific drawings.

[0010] Such as figure 1 As shown: the silicon-based LED street light source module includes fluorescent glue 1, LED chip 2, lead electrode 3, chip pad 4, silver plating layer 5, silicon base body 6, via hole 7, light source pad 8, substrate solder Disk 9, insulating layer 10, heat dissipation substrate body 11, etc.

[0011] Such as figure 1 As shown, the present invention includes a heat dissipation substrate body 11, an insulating layer 10 is arranged on the front side of the heat dissipation substrate body 11, and a plurality of light sources are arranged on the insulating layer 10 through substrate pads 9; the light source includes a silicon base body 6, and the silicon base A plurality of via holes 7 are arranged on the body 6, the via holes 7 penetrate the upper and lower surfaces of the silicon base body 6, silver, gold, copper or gold-tin alloy are filled in the via ...

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Abstract

The invention relates to an LED (light emitting diode) street lamp light source module with silicon substrates. The LED street lamp light source module with the silicon substrates is characterized by comprising a radiating substrate body, wherein a plurality of light sources are arranged on the radiating substrate body through a substrate bonding pad; each light source comprises a silicon substrate body; a plurality of via holes are formed in each silicon substrate body; the via holes penetrate in the upper surface and the lower surface of the silicon substrate bodies; the via holes are filled with silver, gold, copper or gold-tin alloy; a light source bonding pad is arranged on the lower surface of each silicon substrate body; a lead electrode is arranged on the upper surface of each silicon substrate body; the lead electrodes are connected with LED chips through chip bonding pads; fluorescent glue is arranged on the upper surfaces of the silicon substrate bodies, and covers the LED chips and the upper surfaces of the silicon substrate bodies; a silver coating is arranged on the upper surface of each silicon substrate body except for the area of the corresponding lead electrode; and gold plating layers or gold-tin alloy plating layers are arranged on an area, which is in contact with the corresponding lead electrode, of the upper surface of each silicon substrate body and the surface of the corresponding chip bonding pad. By using the LED street lamp light source module, heat resistance of the chips and heat resistance of a radiator of a finished product of a street lamp are reduced, the heat dispersion of the lamp is high, and the service life of the whole lamp is long.

Description

technical field [0001] The invention relates to a LED street light source, in particular to a silicon-based LED street light source module. Background technique [0002] At present, most of the light sources used for LED street lamps are gold-wire-packaged light sources in the form of imitation lumens. The weakness of this type of light source lies in the use of gold-wire connection technology. The chip and the bracket must be bonded and fixed with silver glue. The form bracket is silver-plated plastic-coated iron or silver-plated plastic-coated copper, which has poor heat dissipation. Contents of the invention [0003] The object of the present invention is to overcome the deficiencies in the prior art and provide a silicon-based LED street light light source module, which realizes the modularization of the light source on the one hand and has better heat dissipation performance on the other hand. [0004] According to the technical solution provided by the present inven...

Claims

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Application Information

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IPC IPC(8): F21S8/00F21V29/00F21V23/00H01L33/00F21W131/103F21Y101/02F21V29/502
Inventor 周锋华利生
Owner JIANGSU XGL OPTOELECTRONICS
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