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Semiconductor microwave oven

A technology of semiconductor and microwave oven, which is applied in the direction of household stoves/stoves, household heating, lighting and heating equipment, etc., to achieve the effects of small size, increased heating rate, and simple design structure

Active Publication Date: 2014-06-11
GUANGDONG MIDEA KITCHEN APPLIANCES MFG CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a semiconductor microwave oven, which aims to solve the heat dissipation problem of the semiconductor tube in the existing semiconductor microwave oven and provide a heat dissipation method that meets the requirements.

Method used

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  • Semiconductor microwave oven
  • Semiconductor microwave oven
  • Semiconductor microwave oven

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] See Figure 4 to Figure 7 , as a specific implementation of the semiconductor microwave oven provided in Embodiment 1 of the present invention, the tensile structure 11 of the cavity is provided with a concave stretching groove 110, and the circuit board 211 is fixed on the outer surface of the tensile structure 11 of the cavity and The upper surface of the semiconductor tube 212 is close to the bottom surface of the stretch groove 110, and the semiconductor tube 212 is welded or screwed in the stretch groove 110 of the cavity stretch structure 11 to ensure that the heat generated by the semiconductor tube 212 can be minimized. The resistance conducts to the outer surface of the cavity tensile structure 11, and then conducts to the entire cavity 1, so that the heat can be quickly dissipated.

Embodiment 2

[0039] See figure 1 , Figure 8 to Figure 10, different from Embodiment 1, the semiconductor tube in this embodiment is not directly arranged on the cavity drawing structure 11, and the semiconductor microwave oven also includes a radiator 3, and the radiator 3 includes a heat dissipation base 30, a cooling assembly 32 and a heat conducting member 31, one end of the heat conduction member 31 extends into the interior of the heat dissipation base 30 and is fixed, and the other end extends into the interior of the cooling assembly 32 and is fixed. The heat dissipation base 30 is tightly and fixedly connected with the cavity tensile structure 11, and the cooling assembly 32 The heat conduction member 31 is extended to the outside of the cavity 1 and installed and fixed. The heat dissipation base 30 is provided with a mounting groove 300. The bottom surface of the groove 300 is in close contact, and the semiconductor tube 212 is welded or screwed into the installation groove 300 ...

Embodiment 3

[0044] See Figure 11 to Figure 14 The difference between the third embodiment and the first embodiment is that the area of ​​the bottom of the cavity 1 occupied by the cavity tensile structure 12 is reduced relative to the cavity tensile structure 11, and at the same time, the bottom of the cavity 1 is located at the bottom of the cavity On the side of the body tensile structure 12, there is also a downwardly protruding heat dissipation tensile structure 13 integrally formed with the cavity 1. The heat dissipation tensile structure 13 can increase the area of ​​the heat dissipation surface and further improve the heat dissipation effect of the cavity 1. .

[0045] Further, see Figure 12 and Figure 14 , as a specific implementation of the semiconductor microwave oven provided in Embodiment 3 of the present invention, a second heat dissipation fan 42 is provided below the heat dissipation tensile structure 13 and at a position facing the heat dissipation tension 13, and the...

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PUM

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Abstract

The invention is applicable to the technical field of microwave oven production, and provides a semiconductor microwave oven. The semiconductor microwave oven comprises a cavity and a semiconductor power source arranged outside the cavity; the semiconductor power source comprises a semiconductor power plate formed by a circuit board and a semiconductor pipe and a power output structure; the semiconductor pipe and the power output structure are arranged on the circuit board; a cavity stretching structure which is integrally molded with the cavity and protrudes downwards is arranged at the bottom of the cavity; the circuit board is fixed on the outer side of the cavity stretching structure; the semiconductor pipe and the cavity stretching structure are fixedly arranged in a heat transfer manner. The semiconductor microwave oven provided by the invention utilizes the overall cavity as a radiator of the semiconductor power plate by utilizing the characteristics that the cavity is metal and good in heat transfer performance, and the semiconductor power plate is flat, the semiconductor microwave oven is simple in structure, small in volume, and very applicable to structure arrangement of the overall semiconductor microwave oven, and meanwhile, the food inside the cavity can be indirectly heated by utilizing the heat emitted by the semiconductor power plate. Thus, the heating rate is improved.

Description

technical field [0001] The invention belongs to the technical field of microwave oven production, and more specifically relates to a heat dissipation structure of a semiconductor microwave oven. Background technique [0002] The emergence of semiconductor microwave oven products has set off a revolution in the microwave oven industry. This kind of microwave oven has borrowed the relevant technologies of semiconductor applications in the communication industry, and used the full DC semiconductor chip oscillation principle to reduce the voltage required by microwave ovens from 4000 volts to 32 volts. Standard 2450MHz±50MHz (ie 2.45G) frequency band microwave for microwave heating. The microwave power is determined by the power and number of semiconductor chips, so semiconductor microwave ovens are also called RF radio frequency microwave ovens or solid-state microwave ovens. The semiconductor microwave oven has canceled the magnetron, and no longer needs a high-voltage power ...

Claims

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Application Information

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IPC IPC(8): F24C7/02F24C7/06
Inventor 唐相伟欧军辉张尔雄彭定元张林海
Owner GUANGDONG MIDEA KITCHEN APPLIANCES MFG CO LTD