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Light shield and its designing method

A design method and photomask technology, applied in optomechanical equipment, optics, originals for optomechanical processing, etc., can solve problems such as unfavorable packaging process, affecting the bonding between solder balls and substrate 1, and other problems

Active Publication Date: 2014-06-18
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Because in the subsequent packaging process, solder balls will be filled in the groove 4, the existence of the lift 21 will affect the filling of the solder balls, such as easy to cause voids in the solder balls, affecting the combination of the solder balls and the substrate 1, etc., resulting in Detrimental effects on the subsequent packaging process

Method used

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  • Light shield and its designing method
  • Light shield and its designing method

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Embodiment Construction

[0044] In order to make the objectives, technical solutions, and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0045] Such as Figure 4 As shown, the photomask 3 provided by the present invention includes a light-transmissive part 31 and a light-impermeable part 32 forming a mask pattern. The light-permeable part 31 is provided with diffraction adjacent to the edge of the light-impermeable part 32. Grating structure area 33. Such as Figure 5 As shown, the grating stripes of the diffraction grating structure region 33 are parallel to the edge of the opaque portion 32 adjacent to the diffraction grating structure region 33.

[0046] Such as Image 6 Shown is a schematic diagram of the exposure process of the polyimide film 2 using the mask 3 of the present invention. Because there is a diffraction grating structure region 33 in the photomask 3 of the present...

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Abstract

The invention discloses a light shield and its designing method. The light shield comprises a transparent part and a lightproof part forming a light shield pattern, the transparent part is partially provided with a diffraction grating structure area adjacent to the edge of the lightproof part, and the grating strip of the diffraction grating structure area parallels to the edge of the adjacent lightproof part. The diffraction grating structure area adjacent to the edge of the lightproof part is designed in the transparent part of the light shield, so the energy of the area exposed to a polyimide film changes, thereby the morphology of the exposed polyimide film is changed, the polyimide film with no tilting can be obtained after heating curing treatment, and an unfavorable influence of tilting on filing solder balls in the subsequent packaging process of an IC circuit is solved.

Description

Technical field [0001] The present invention relates to semiconductor manufacturing technology, in particular to a photomask used in photolithography at the packaging stage in an IC manufacturing process and a design method of the photomask. Background technique [0002] In semiconductor manufacturing technology, in the packaging stage of IC (integrated circuit), a layer of polyimide (polyimide) film is coated on the surface of the substrate containing the chip to protect the substrate; then light is used Engraving means exposes, develops and heats and cures the polyimide film, and finally forms a groove in the required part of the polyimide film to expose the part of the conductive layer in the substrate that needs to be electrically connected to the outside; then fill the groove in the groove To make an electrical connection with the outside world. After the polyimide film is heated and cured, the morphology of the polyimide film will undergo some undesirable changes. Therefor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F1/48G03F7/00
Inventor 曹存朋朱晓峥
Owner SEMICON MFG INT (SHANGHAI) CORP
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