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LED (light-emitting diode) packaging method

A transparent encapsulation, half-etching technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of low reliability of LEDs, and achieve the effect of increasing difficulty, high reliability and low packaging cost

Active Publication Date: 2014-06-18
SHENZHEN REFOND OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the embodiments of the present invention is to provide an LED packaging method, which aims to solve the problem of low reliability of the LED produced by the existing packaging method

Method used

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  • LED (light-emitting diode) packaging method

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Embodiment Construction

[0026] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0027] In the embodiment of the present invention, a plurality of parallel first half-etched grooves are etched on the upper part of the metal etching sheet, and then the positive and negative electrodes of the LED flip chip are respectively welded to both sides of the first half-etched grooves, and then the metal Coat the fluorescent glue covering the LED flip chip on the etched sheet and let it solidify, then form the transparent silica gel covering the fluorescent glue on the metal etched sheet and let it solidify, and then etch the bottom of the metal etched sheet with the first The half-etched...

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Abstract

The invention is suitable for the technical field of LED (light-emitting diode) packaging, and provides an LED packaging method. The LED packaging method is characterized by comprising the steps of etching a plurality of parallel first half etching grooves on the upper part of a metal etching sheet; respectively welding a positive electrode and a negative electrode of an LED flip chip to the two sides of the first half etching grooves; coating fluorescence glue for covering the LED flip chip on the metal etching sheet and solidifying the fluorescence glue; forming transparent silicon glue for covering the fluorescence glue on the metal etching sheet and solidifying the transparent silicon glue; etching second half etching grooves communicated with the first half etching grooves at the bottom of the metal etching sheet; cutting to form LEDs. The LED formed through such a packaging method adopts the metal etching sheet serving as the positive electrode and the negative electrode of the LED between the chip electrode and a welding electrode at the application end for transition, so that no difficulty is increased at the application end in use of the LED product, and the method is completely equal to the use method of an injection molding support.

Description

technical field [0001] The invention belongs to the technical field of LED packaging, in particular to an LED packaging method. Background technique [0002] The packaging method of white light LED products is to fix the LED chip on the bracket by bonding or eutectic welding, use gold wires to connect the positive pole of the chip to the positive pole of the bracket, and connect the negative pole of the chip to the negative pole of the bracket, and then Fill with phosphors that match the target color zone. Due to the different thermal expansion coefficients of brackets and wafer colloids, reliability problems are prone to occur in brackets, die-bonding glue, gold wires, colloids, etc., and there are many types of LED brackets. The materials for bonding the positive and negative electrodes of the bracket are PPA, PCT, and EMC. , in terms of high temperature resistance and air tightness, there are relatively large defects, which affect the reliability of LED products; ceramic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/62
CPCH01L33/486H01L33/62H01L2933/0066
Inventor 裴小明曹宇星
Owner SHENZHEN REFOND OPTOELECTRONICS
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