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White curable composition for optical semiconductor device, molded article for optical semiconductor device and optical semiconductor device

A technology of optical semiconductor device and curable composition, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device parts, semiconductor devices, etc., to achieve the effects of not easy to reduce quality, suppress discoloration, and improve adhesion

Inactive Publication Date: 2014-06-25
SEKISUI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the examples of the above document 1, titanium oxide was not used

Method used

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  • White curable composition for optical semiconductor device, molded article for optical semiconductor device and optical semiconductor device
  • White curable composition for optical semiconductor device, molded article for optical semiconductor device and optical semiconductor device
  • White curable composition for optical semiconductor device, molded article for optical semiconductor device and optical semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～18 and comparative example 1～8

[0160]Each component shown in the following Tables 1 and 2 was blended in the compounding amounts shown in the following Tables 1 and 2 (the compounding unit is parts by weight), and mixed with a mixer (LABOPLASTOMILL R-60, manufactured by Toyo Seiki Co., Ltd.) for 15 minutes to obtain a kneaded product.

[0161] (Evaluation)

[0162] (1) PCT resistance characteristics

[0163] The obtained kneaded product was heat-treated at 40° C. for 30 hours to be cured. The solidified kneaded product is pulverized, and a sheet-like product (curable composition) is formed.

[0164] After forming a circuit by etching on a copper material (TAMAC194), silver plating was performed to obtain a lead frame with a thickness of 0.2 mm. Using a plunger injection method device (“YPS-MP” manufactured by TOWA Corporation), the above-mentioned curable composition was produced on the lead frame by plunger injection (molding temperature 170° C., molding time 3 minutes) by the MAP molding method. The o...

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PUM

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Abstract

Provided is an optical semiconductor device which shows little degradation even if used in a severe environment, can prevent color change in an electrode, and can improve the adhesion of a molded article to a member that is in contact with the molded article. A white curable composition for optical semiconductor devices according to the present invention, said white curable composition being used to obtain a molded article which is placed beside an optical semiconductor element in an optical semiconductor device, in which an area surrounded by the inner surface is packed with a sealing agent before using to seal the optical semiconductor element, and which is provided with an opening for taking out light emitted by the optical semiconductor element, comprises an epoxy compound having an epoxy group, an acid anhydride curing agent, titanium oxide, spherical silica and ground silica, wherein the average grain size of the spherical silica is 5-100 mum inclusive.

Description

technical field [0001] The present invention relates to a white curable composition for an optical semiconductor device that is preferably used in order to obtain a molded body having an opening for guiding light emitted from an optical semiconductor element to the outside. Moreover, this invention relates to the molded object for optical semiconductor devices using this white curable composition for optical semiconductor devices, and an optical semiconductor device. Background technique [0002] Optical semiconductor devices such as light emitting diode (LED) devices have low power consumption and long life. In addition, the optical semiconductor device can be used even in a harsh environment. Therefore, the optical semiconductor device can be widely used for a backlight for a mobile phone, a backlight for a liquid crystal television, a lamp for an automobile, a lighting fixture, a billboard, and the like. [0003] When an optical semiconductor element (eg, LED), which is...

Claims

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Application Information

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IPC IPC(8): H01L23/29C08L63/00H01L23/02H01L23/08H01L23/31
CPCH01L23/293H01L23/24H01L2224/45015H01L2924/10253C08G59/42H01L2224/73265H01L24/45H01L23/3107H01L2224/45144H01L2224/32225H01L21/561H01L2224/97C09J163/00H01L24/97H01L2224/48227H01L24/73H01L2924/12041H01L2924/181
Inventor 鹿毛崇至樋口勋夫福田崇志保井秀文中村秀渡边贵志
Owner SEKISUI CHEM CO LTD
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