Conductive adhesive composition and conductive adhesive membrane

A technology of conductive adhesives and compositions, applied in the direction of conductive adhesives, aldehyde/ketone condensation polymer adhesives, adhesives, etc., can solve problems such as reducing instrument reliability

Inactive Publication Date: 2014-07-16
新纶电子材料(常州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In addition, with the miniaturization and weight reduction of electronic instruments, printed circuit boards have developed from single-sided, double-sided, high-density double-sided and multi-layered. The conduction of the two-sided circuits of traditional double-sided boards mostly uses general silver conductive glue, but due to the Silver will migrate in a humid environment, thereby reducing the reliability of the instrument, so the anti-migration performance of the conductive adhesive is particularly important

Method used

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  • Conductive adhesive composition and conductive adhesive membrane
  • Conductive adhesive composition and conductive adhesive membrane
  • Conductive adhesive composition and conductive adhesive membrane

Examples

Experimental program
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Embodiment 1

[0044] The present embodiment provides a conductive adhesive composition, including the following components: in parts by weight, polyamide elastomer: TPAE-32 (produced by T&K TOKA Co., Ltd.) 15 parts by weight; acrylic elastomer: SG-708- 6T (carboxyl group-containing acrylic resin, manufactured by NagaseChemteX Corporation) 15 parts by weight; epoxy resin: Epikote 828 (manufactured by Japan Epoxy Resins Co., Ltd., number of epoxy groups per molecule: 2) 50 parts by weight; phenolic resin: CKM -1282 (produced by Japan Showa Polymer Co., Ltd.) 20 parts by weight; accelerator: 2E4MZ (produced by Shikoku Chemicals Co., Ltd., Japan) 0.5 parts by weight; conductive particles: CE-1110 (dendritic, produced by Fukuda Metal Foil Powder Industry Co., Ltd.) 50 Parts by weight; solvent methyl ethyl ketone (MEK) 225 parts by weight.

[0045] The conductive adhesive composition of this embodiment was prepared by kneading for 3 hours by a planetary mixer at room temperature and a rotation sp...

Embodiment 2

[0047] This embodiment provides a conductive adhesive composition, including the following components: in parts by weight, polyamide elastomer: TPAE-32 (produced by T&K TOKA Co., Ltd.) 55 parts by weight; acrylic elastomer: SG-708- 6T (carboxyl-containing acrylic resin, manufactured by NagaseChemteX Corporation) 15 parts by weight; epoxy resin: Epikote 828 (manufactured by Japan Epoxy Resins Co., Ltd., number of epoxy groups per molecule: 2) 30 parts by weight; accelerator: 2E4MZ (Shikoku Kasei Co., Ltd.) 0.4 parts by weight; conductive particles: CE-1110 (dendritic, produced by Fukuda Metal Foil Powder Industry Co., Ltd.) 100 parts by weight; solvent methyl ethyl ketone (MEK) 300 parts by weight.

[0048] The conductive adhesive composition of this embodiment was prepared by kneading for 3 hours by a planetary mixer at room temperature and a rotation speed of 100 rpm.

Embodiment 3

[0050] The present embodiment provides a conductive adhesive composition, including the following components: in parts by weight, polyamide elastomer: TPAE-32 (produced by T&K TOKA Co., Ltd.) 15 parts by weight; acrylic elastomer: SG-708- 6T (carboxyl-containing acrylic resin, manufactured by NagaseChemteX Corporation) 55 parts by weight; phenolic resin: 30 parts by weight of CKM-1282 (manufactured by Japan Showa Polymer Co., Ltd.); accelerator: 2E4MZ (manufactured by Shikoku Chemicals Co., Ltd., Japan) 0.05 parts by weight ; Conductive particles: CE-1110 (dendritic, produced by Fukuda Metal Foil Powder Industry Co., Ltd.) 40 parts by weight; solvent methyl ethyl ketone (MEK) 210 parts by weight.

[0051] The conductive adhesive composition of this embodiment was prepared by kneading for 3 hours by a planetary mixer at room temperature and a rotation speed of 100 rpm.

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Abstract

The invention provides a conductive adhesive composition. The conductive adhesive composition comprises the following components: A, 15-55 parts by weight of polyamide elastomer; B, 15-55 parts by weight of acrylic acid elastomer; C, 30-70 parts by weight of epoxy resin and/or phenolic resin; D, 0.001-1 part by weight of curing accelerator; E, 30-100 parts by weight of conductive particles, wherein the total weight of A, B and C is 100 parts by weight. The invention also provides a conductive adhesive membrane. By adopting two special thermoplastic elastomers, epoxy resin and/or phenolic resin and conductive particles in a special structure, the conductive adhesive and the conductive adhesive membrane which have good bonding strength, heat resistance, conductivity, mobility resistance and operability can be obtained.

Description

technical field [0001] The invention relates to a conductive adhesive composition and a conductive adhesive film, belonging to the technical field of conductive adhesives. Background technique [0002] Chloroprene-based conductive adhesives are generally used for bonding electrode films of touch panels to connectors and for connecting various film substrates (eg, Japanese Patent Application Laid-Open No. 2004-143219). This type of conductive adhesive has the advantages of no initial adhesion on the surface of the product, and it can be stored at room temperature for a short period of time. [0003] However, in recent years, due to environmental problems and increasing demands for safety, conductive adhesives are strongly required to be halogen-free adhesives. In addition, conventional chloroprene-based conductive adhesives do not necessarily meet the requirements in terms of adhesive strength, heat resistance, and workability depending on the application. In particular, as ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J161/06C09J177/12C09J133/00C09J9/02C09J7/00
Inventor 龙冲向如亭
Owner 新纶电子材料(常州)有限公司
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