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Thermal conductive resin composition and molded body

A technology of resin composition and thermal conductivity, applied in the direction of conductors, insulated conductors, conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problems of unrecyclable environment, load, etc., and achieve good dimensional stability and smoothness Excellent, excellent dimensional stability effect

Inactive Publication Date: 2014-07-23
TOYO INK SC HOLD CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, silicone rubber is a burden on the environment because it cannot be recycled

Method used

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  • Thermal conductive resin composition and molded body
  • Thermal conductive resin composition and molded body
  • Thermal conductive resin composition and molded body

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0077] [Production of Thermally Conductive Resin Composition]

[0078] Put 100 parts of magnesium carbonate particles A1 with 1 part of surface treatment agent B1 for surface treatment of 80 parts of thermally conductive particles and 20 parts of thermoplastic resin C1 into the Henschel mixer, under the conditions of a temperature of 20°C and a time of 3 minutes Perform pre-mixing and obtain a mixture. After that, the mixture was supplied to an extruder with a screw diameter of 30 mm and L / D (screw diameter / screw length) = 38 to 42, and melted and kneaded under the conditions of a rotation speed of 250 rpm and a set temperature of 220°C. A pelletizer is used to shape the extruded kneaded product into small balls. In this way, a thermally conductive resin composition is obtained.

[0079] [Evaluation method]

[0080] Using the obtained thermally conductive resin composition, the following evaluation items were tested. The results are shown in Table 2.

[0081] [Melt viscosity]

[00...

Embodiment 2～25、 comparative example 1～3

[0102] With the blending of the thermally conductive resin described in Table 2, pellets were produced in the same manner as in Example 1, and evaluated in the same manner as the above method. The results are shown in Table 2.

Embodiment 26

[0110] 40 parts of thermally conductive particles obtained by surface treatment of 100 parts of magnesium carbonate particles A1 with 1 part of surface treatment agent B1, 40 parts of thermally conductive particles obtained by surface treatment of 100 parts of magnesium carbonate particles A4 with 1 part of surface treatment agent B1, and Twenty parts of thermoplastic resin C1, except for the above three types, were used to produce pellets in the same manner as in Example 1, and evaluated by the same method as above. The results are shown in Table 3.

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Abstract

The invention provides a thermal conductive resin composition and a molded body formed by using the thermal conductive resin composition. The thermal conductive resin composition, although containing large amount of thermal conductive particles, has excellent molding processability, and can be used for obtaining, for example in injection molding, a molded body with excellent size stability, or in extrusion molding, a molded body with excellent smoothness and good mechanical properties. The thermal conductive resin composition provided by the invention contains terminal conductive particles with an average primary particle size of 0.1-30[mu]m, and thermoplastic resin. The terminal conductive particle includes a magnesium carbonate particle and a coating which is formed through a surface treating agent including methoxysilyl and alkyl.

Description

Technical field [0001] The present invention relates to a thermally conductive resin composition that can be used to remove heat generated by electric and electronic equipment and the like, and a molded body formed by molding the thermally conductive resin composition. Background technique [0002] In recent years, in the field of electrical and electronic equipment, along with the advancement of higher functionality or higher density, and simplification, the transmitted signals have become more high-frequency, and the heat generated from parts such as semiconductors, power supplies, and light sources has also increased. Similarly, in equipment such as LED lighting using wiring circuits, the amount of heat generated is also increasing. Therefore, in such equipment, in order to ensure its stable operation, heat dissipation countermeasures become very important. [0003] As one of the heat dissipation countermeasures, components for heat dissipation, such as a heat dissipation plate...

Claims

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Application Information

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IPC IPC(8): C08L23/08C08L69/00C08K9/10C08K9/06C08K3/26C08K3/38
CPCC08K3/26C08K3/38C08K9/06C08K9/10C08K2003/267C08K2003/385C08K2201/003C08L23/0815C08L69/00C08J5/00C08K2003/282C08K2003/382C08L101/12H01B1/20H01B7/421
Inventor 堀口峻志藤若贵之
Owner TOYO INK SC HOLD CO LTD
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