Gel having improved thermal stability

A gel, organic technology for applications in the field of gels with improved thermal stability, which can solve the problems of brittleness, cracking, silicone hardening, etc.

Inactive Publication Date: 2014-07-23
DOW CORNING CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when used in high performance electronics including electrodes and small wires, typical silicones tend to harden, become brittle and crack after exposure to long duty cycles and high heat
Hardening and cracking breaks or destroys electrodes and wires, causing electrical failure

Method used

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  • Gel having improved thermal stability
  • Gel having improved thermal stability
  • Gel having improved thermal stability

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example

[0071] A series of gels (gels 1-10) were formed according to the present disclosure. Two comparative gels (Comparative Gels 1 and 2) were also formed but did not include the phthalocyanines of the present disclosure. Each of Gels 1-10 and Comparative Gels 1 and 2 were evaluated to determine initial hardness, hardness after heat aging, and viscosity.

[0072] The constituents used to form each of the gels and the results of the above evaluations are shown in Table 2 below. More specifically, equal parts by weight of Part A and Part B were mixed and degassed to form a mixture. The mixture was then poured into aluminum cups and cured at 150°C for 1 hour to form a gel. Subsequently, the gel was cooled and the initial hardness and viscosity were determined according to the methods detailed above. The gels were then heat aged and evaluated again for hardness after heat aging at 225°C for 1000 hours. In Table 2, all weight percentages shown in Part A are based on the total weight...

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Abstract

A gel has improved thermal stability and is the hydrosilylation reaction product of (A) an organopolysiloxane having an average of at least 0.1 silicon-bonded alkenyl group per molecule and (B) a cross-linker having an average of at least 2 silicon-bonded hydrogen atoms per molecule. (A) and (B) react via hydrosilylation in the presence of (C) a hydrosilylation catalyst and (D) a phthalocyanine. The (D) phthalocyanine is present in an amount of from about 0.05 to about 30 weight percent based on a total weight of (A) and (B). The gel has a hardness of less than about 1500 grams as measured after heat ageing at 225 DEG C for 1000 hours that is calculated as a weight required to insert a TA-23 probe into the gel to a depth of 3 mm.

Description

technical field [0001] The present invention generally relates to gels that are hydrosilylation reaction products having improved thermal stability and electronic articles comprising the same. Background technique [0002] Typical silicones have excellent stress buffering properties, electrical properties, heat resistance and weather resistance and are useful in many applications. In many applications, silicones are used to transfer heat from heat-generating electronic components. However, when used in high performance electronics including electrodes and small wires, typical silicones tend to harden, become brittle and crack after exposure to long duty cycles and high heat. Hardening and cracking break or destroy electrodes and wires, causing electrical failure. Therefore, there remains an opportunity to develop improved silicones. Contents of the invention [0003] The present invention provides gels with improved thermal stability. The gel is (A) an organopolysiloxa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08K5/00H01L21/56
CPCC08L83/04H01L23/296C08K5/0091H01L2924/0002H01L2924/00C08G77/04C08G2190/00C08G2220/00H01L29/7393
Inventor 德瑞布·E·巴瓦格尔玄大涉凯利·J·梅辛肯特·R·拉森
Owner DOW CORNING CORP
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