Semiconductor device and manufacturing method thereof
A semiconductor and conductor technology, applied in semiconductor devices including fins and its manufacturing field, can solve problems such as low yield, self-heating effect of back gate, difficulty in forming back gate, etc.
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[0015] Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings. In the various figures, identical elements are indicated with similar reference numerals. For the sake of clarity, various parts in the drawings have not been drawn to scale.
[0016] For the sake of simplicity, the semiconductor structure obtained after several steps can be described in one figure.
[0017] It should be understood that when describing the structure of a device, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean being directly on another layer or another region, or Other layers or regions are also included between it and another layer or another region. And, if the device is turned over, the layer, one region, will be "below" or "beneath" the other layer, another region.
[0018] If it is to describe the situation of being directly on another layer or another area, the expression "d...
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