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Exposure device and exposure method

Through the design of the combination of the cylindrical mask system and the stage, efficient exposure of the exposure device is achieved, which solves the problems of low exposure efficiency and output in the existing technology, and improves the output and efficiency per unit time. .

Active Publication Date: 2014-09-10
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
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AI Technical Summary

Problems solved by technology

[0008] The exposure efficiency and output per unit time of the existing exposure device are low

Method used

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Embodiment Construction

[0043] When the existing exposure device performs exposure, the first stage moves along the scanning direction, and at the same time, the mask stage moves along the direction opposite to the scanning direction, thereby completing the exposure of one exposure area, and exposing one exposure area After that, the second exposure area is then exposed. For details, please refer to figure 2 , figure 2 It is a schematic diagram of the scanning direction of each exposure area of ​​the existing exposure device, figure 2 There are multiple exposure areas on the first wafer 106. After the first stage scans along the first direction to complete the exposure of the first exposure area 11, it then scans along the direction opposite to the first direction to complete the phase alignment. The exposure of the adjacent second exposure area 12 repeats the above process until the exposure of all exposure areas on the first wafer 106 is completed. When the above method exposes each exposure a...

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Abstract

The invention relates to an exposure device and an exposure method thereof. The exposure device includes: a base station; a wafer stage group, which comprises a plurality of wafer stages that make circulating movement between a first position and a second position on the base station in order; an alignment detection unit, which is used for wafer alignment; a cylindrical mask plate system, which is used for loading a cylindrical mask plate and making the cylindrical mask plate rotate around a central shaft; an optical projection unit, which projects the light permeating the cylindrical mask plate to wafer exposure areas on the wafer stages. When the wafer stages move from the first position to the second position and unidirectional scanning is carried out along the scanning direction, the cylindrical mask plate rotate around the central shaft, the light permeating the cylindrical mask plate is projected to the wafers so as to expose one column of exposure areas arranged along the scanning direction on the wafers. During exposure, the wafer stages have no need for change of the scanning direction, thus saving the exposure time and improving the exposure efficiency.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to an exposure device and an exposure method thereof. Background technique [0002] As a very important process in the semiconductor manufacturing process, photolithography is the process of transferring the pattern on the mask plate to the wafer through exposure, and is considered to be the core step in the manufacture of large-scale integrated circuits. A series of complex and time-consuming photolithography processes in semiconductor manufacturing are mainly completed by corresponding exposure machines. The development of lithography technology or the progress of exposure machine technology mainly revolves around the three major indicators of line width, overlay accuracy and output. [0003] In semiconductor manufacturing, the exposure process mainly includes three major steps: the step of replacing the wafer on the stage; the step of aligning the wafer on the stage; t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20G03F1/42G03F9/00
CPCG03F7/70733G03F9/7003G03F7/70775G03F9/7088G03F7/703G03F7/70725G03F7/70141G03F1/42G03F7/24G01D5/34746H01L21/681H01L21/682
Owner SEMICON MFG INT (SHANGHAI) CORP
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