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Inorganic LED packaging support and packaging method thereof

A technology for LED brackets and packaging brackets, applied in the field of LED brackets, can solve problems such as differential thermal expansion coefficient stress, and achieve the effects of improving fatigue life, facilitating installation, and enhancing air tightness

Active Publication Date: 2014-09-10
HONGLI ZHIHUI GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide an LED inorganic packaging bracket and its packaging method, which can overcome the problem of stress between the existing inorganic packaging glass lens and the bracket due to the difference in thermal expansion coefficient

Method used

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  • Inorganic LED packaging support and packaging method thereof
  • Inorganic LED packaging support and packaging method thereof
  • Inorganic LED packaging support and packaging method thereof

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Embodiment Construction

[0027] The present invention will be further described below in conjunction with the accompanying drawings of the description.

[0028] Such as Figures 1 to 3 As shown, an LED inorganic packaging bracket includes a bracket body 1 and a glass lens 4 that covers the bracket body 1 . The glass lens 4 is square, and the glass lens 4 is provided with a spherical protrusion, so that the lens has a certain light distribution effect. In addition, as Figure 4 As shown, the glass lens 4 can also be a common glass plate. Such as image 3 As shown, the bracket body 1 is provided with a square depression 3 for accommodating LED chips, the top inner edge of the bracket body 1 is provided with a first step 6 surrounding the depression, and the top of the bracket body 1 A second step 7 is provided on the periphery of the first step 6, the second step 7 is higher than the first step 6, a first transition surface is formed between the second step 7 and the first step 6, and the top of the ...

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Abstract

Disclosed are an inorganic LED packaging support and a packaging method. The packaging method includes: (1) subjecting an LED chip to crystal solidification and wire welding; (2) printing solder paste on a second step of a support body by a steel net printing technology; (3) preheating the support body so that the solder paste cannot melt and interference fit between a first step of the support body and glass lenses in a normal temperature can be expanded into clearance fit; (4) arranging the glass lenses on a mold fit for the support body; (5) taking out the preheated support body and combining the preheated support body with the glass lenses; (6) subjected an LED support with the lenses to reflow welding for one time. Since a thermal expansion coefficient of a material used on a second metal layer on a first transition surface is larger than that of the glass lenses, and expanding size of the first step is larger than that of the glass lenses, fit between the glass lenses and the first step during working is changed to transition fit, extruding stress is released, and fatigue life of the material is improved.

Description

technical field [0001] The invention relates to an LED bracket, in particular to an LED inorganic packaging bracket and a packaging method thereof. Background technique [0002] LED is a light-emitting diode, which is a solid semiconductor light-emitting device. With the development of LED technology, the packaging wavelength band of LED is gradually developing towards near ultraviolet or even deep ultraviolet, and the power is also developing towards high power. However, traditional silicone packaging is used. For example, in-line LEDs are mostly packaged with epoxy resin, and SMD LEDs are mostly packaged with silicone or silica gel. However, such silicone materials will be damaged by water under long-term service conditions. The effects of factors such as light, heat, etc. are prone to failure, resulting in a sharp attenuation of the luminous flux and radiation flux of the device, and even lead to device failure. For high-power LED integrated light sources, due to variou...

Claims

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Application Information

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IPC IPC(8): H01L33/62H01L33/48
CPCH01L33/483H01L2933/0033
Inventor 何永泰乔翀李坤锥李恒彦
Owner HONGLI ZHIHUI GRP CO LTD
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