Manufacturing method of magnetic core laminated blind hole electromagnetic induction multilayer printed circuit board

Abstract

The invention relates to the technical field of printed-circuit boards and provides a manufacturing method for a magnetic core-laminated type multi-layer printed-circuit board with electro-magnetic induction through blind holes. The main manufacturing process steps include laminating the magnetic core, circularising the blind holes and combining the multiple layers. The method includes embedding the magnetic core in a double-layer substrate, then forming through holes in the substrate with the magnetic core embedded, and insulating the through holes through vacuum caulking technology; forming concentric metallized blind holes with smaller radiuses in the insulated through holes, allowing the metallized blind holes to generate the electro-magnetic induction with the magnetic core in a non-contact manner to replace the traditional electrical inductance producing; meanwhile, performing a circuitry etching on the substrate surface to electrically conduct the blind holes and the substrate surface, and metallizing the through holes which are formed at the position embedded with the magnetic core of the multi-layer composite substrate after multiple layers are combined, thereby achieving conduction of the metallized blind holes and an outer circuit to meet processing requirements of different layers. The manufacturing method has the advantages of small inductance size, large mounting area, high power stability and capability of processing printed circuit boards of multiple layers.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing a magnetic core laminated blind hole electromagnetic induction multilayer printed circuit board. Background technique [0002] At present, the basic inductive components of the power module in the electronics industry are mounted on the surface of the printed circuit board. According to this, the area of ​​the inductive component mounted excessively occupies the surface of the printed circuit board, and even accounts for 50% of the surface area of ​​the printed circuit board. left and right, seriously hindering the process of miniaturization of power supply products. [0003] In order to meet the needs of the development of miniaturization of power supply products, the industry has gradually begun to embed the magnetic core part of the core component of the inductor inside the printed board, and gradually realize the miniaturization of po...

AI Technical Summary

Problems solved by technology

However, this method will cause problems such as conductor contact with the magnetic core or matching of the circular magnetic core, the reliability of the power supply will be at risk, the generality of the design scheme cannot be realized, and there will be great difficulties in processing, production and popularization, and will also cause costs. stay high

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