A projected capacitive screen without bridging and its manufacturing method

A manufacturing method and technology of capacitive screen, applied in the field of capacitive screen, can solve the problems of poor shadow elimination effect, difficult to control yield, difficult to control yield, etc., so as to ensure optical transmittance, improve yield, and save bridging process Effect

Active Publication Date: 2018-08-03
四川点燃科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The projected capacitive screens in the prior art mainly have the following structures: (1) GG mode; the first G is the protective glass, and the second G is the SENSOR sensor, that is, double-sided ITO glass, and the electrodes in the X direction are formed The pattern of the X-axis electrode layer and the Y-axis electrode pattern formed by the Y-direction electrode are respectively made on the two sides of the double-sided ITO glass, and the X-direction electrode and the Y-direction electrode are drawn out using metal wires. The GG structure adopts double-layer glass , the structure is thicker
(2) GFF mode; where G is the protective glass and F is the ITO film, which is used to make two ITO films for the X-axis electrode pattern and the Y-axis electrode pattern respectively, and then use OCA to bond them; GFF mode production process needs Using OCA for three times, its light transmission is not good and the yield is difficult to control
(3) GF2 mode; where G is the protective glass, and F is the double-sided ITO film. The X-axis electrode pattern and the Y-axis electrode pattern are respectively made on the front and back sides of F, bonded by OCA, and the X direction is connected by metal wires. The electrode and the Y-direction electrode are led out; during the production process, metal wires connected to the X-axis electrode pattern and the Y-axis electrode pattern need to be produced on both sides of the ITO film, which is difficult to manufacture and difficult to control the yield rate, and its shadow elimination effect is not good
(4) OGS mode, that is, the technology of directly forming an ITO conductive film and sensor on a layer of protective glass, that is, both the X-axis electrode pattern and the Y-axis electrode pattern are made on the protective glass, and the X-axis electrode and Y-axis electrode pattern need to be adjusted during the process The axis electrodes are bridged, and the metal lines connected to the X-axis electrode pattern and the Y-axis electrode pattern are made separately, which is difficult to manufacture and difficult to control the yield

Method used

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  • A projected capacitive screen without bridging and its manufacturing method
  • A projected capacitive screen without bridging and its manufacturing method
  • A projected capacitive screen without bridging and its manufacturing method

Examples

Experimental program
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Embodiment 1

[0081] like figure 2 , image 3 As shown, this embodiment provides a method for manufacturing a projected capacitive screen without bridging, including the following steps:

[0082] S1-0: Fabricate the frame protection layer 6 on the edge of the glass substrate 1 by using a silk screen process or a yellow light process. Specifically, the thickness of the frame protection layer 6 is less than 7um, the thinner the better.

[0083] Specifically, the specific steps of making the frame protective layer 6 by using silk screen printing technology: making a base plate on the glass substrate 1, drying board, developing, drying, revision, printing, drying, and finished product; wherein the drying board includes screen selection, frame selection, stretching Netting, drying, coating or attaching photosensitive adhesive, drying and other steps.

[0084] The specific steps for making the frame protective layer 6 using the yellow light process: pre-PR cleaning (that is, the process of re...

Embodiment 2

[0116] like Figure 4 , Figure 5 As shown, this embodiment provides a method for manufacturing a projected capacitive screen without bridging, including the following steps:

[0117] S2-0: Fabricate the frame protective layer 6 on the edge of the glass substrate 1 by using a silk screen process or a yellow light process. Specifically, its specific steps are consistent with step S1-0 in Embodiment 1. Understandably, the thickness of the frame protection layer 6 is less than 7um, the thinner the better.

[0118] S2-1: Fabricate the first image erasing layer 2 on the glass substrate 1 .

[0119] Specifically, step S2-1 includes:

[0120] S2-11: cleaning and drying the glass substrate 1 by heat.

[0121] S2-12: Under vacuum conditions, one side of the glass substrate 1 is sputtered with niobium pentoxide or silicon oxynitride.

[0122] S2-13: Under vacuum conditions, sputtering is used to plate silicon dioxide on the side coated with niobium pentoxide or silicon oxynitride,...

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Abstract

The invention discloses a bridging-free projection type capacitive screen and a manufacturing method of the bridging-free projection type capacitive screen. The bridging-free projection type capacitive screen comprises a glass substrate, a first shadow eliminating layer arranged on the glass substrate, a first ITO layer arranged on the first shadow eliminating layer, a second shadow eliminating layer arranged on the first ITO layer and a second ITO layer arranged on the second shadow eliminating layer. The first ITO layer comprises an X-axis electrode layer formed by a plurality of electrodes in the X-axis direction. The second ITO layer comprises a Y-axis electrode layer formed by a plurality of electrodes in the Y-axis direction. The bridging-free projection type capacitive screen further comprises metal wires X arranged on the edges of the X-axis electrode layer and metal wires Y arranged on the edges of the Y-axis electrode layer. The metal wires X and the metal wires Y are connected with a flexible circuit board respectively. The bridging-free projection type capacitive screen is light and thin in structure, good in shadow eliminating effect and beneficial for saving manufacturing processes since the bridging process is not needed in the manufacturing process.

Description

technical field [0001] The invention relates to the field of capacitive screens, in particular to a projected capacitive screen without bridging and a manufacturing method thereof. Background technique [0002] The projected capacitive screen is a screen using projected capacitive touch technology. The touch screen panel can detect the change of capacitance at the position when the finger touches it, so as to calculate the position of the finger and perform multi-touch operation. Projected capacitive screens are widely used in various fields of our daily life, such as mobile phones, tablet computers, media players, navigation systems, digital cameras, electrical control, medical equipment and so on. [0003] The projected capacitive touch screen is to etch different ITO conductive circuit modules on two layers of ITO conductive glass coating. The patterns etched on the two modules are perpendicular to each other, and they can be regarded as sliders that change continuously ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F3/044
Inventor 向火平
Owner 四川点燃科技有限公司
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