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Joining material and joining method using same

A technology of bonding materials and solvents, applied in the direction of welding/cutting media/materials, welding equipment, welding media, etc., can solve problems such as oxidation of joint parts, and achieve high reliability

Inactive Publication Date: 2016-05-11
DOWA ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is concern about the oxidation of the joint part that may adversely affect the joint force in the joint part including the surface to be joined and the joint material.

Method used

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  • Joining material and joining method using same
  • Joining material and joining method using same
  • Joining material and joining method using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0136] (Example 1, Comparative Example 1)

[0137] Mix the following materials to obtain a printable adhesive bonding material: as silver nanoparticles with an average primary particle size of 20nm, the caproic acid-coated silver nanoparticle powder obtained above; as a nanometer silver particle with an average primary particle size of 110nm Silver particles, the above-mentioned obtained sorbic acid-coated nano-silver particle powder; as submicron silver particles, 2-1C (manufactured by Tonghe Electronic Technology Co., Ltd.) spherical silver particle powder (average particle diameter (D 50 )800nm, wherein the particles were confirmed by SEM, and the results confirmed that the particles in the field of view were independent particles); as a low boiling point solvent, octanol with a boiling point of 194°C; as a high boiling point solvent, isobornyl ring with a boiling point of 318.3°C Hexanol (MTPH); and as a dispersant, SOLPLUSD540.

[0138] In addition, as a comparative exam...

Embodiment 2

[0153] (Example 2, Comparative Examples 10, 11)

[0154] According to the ratio of the amount of low boiling point solvent to the amount of high boiling point solvent, it is low boiling point solvent: high boiling point solvent = 1:1 coordination embodiment 2, according to low boiling point solvent: high boiling point solvent = 5:3 coordination of comparative example 10, and according to Low boiling point solvent: high boiling point solvent = 1:3 The bonding material of Comparative Example 11 was prepared under the conditions shown in Table 1, and was produced in the same manner as in Example 1. The obtained results are shown in Table 1 together.

[0155] In addition, the ratio of the amount of low-boiling-point solvent to the amount of high-boiling-point solvent in Example 1 is low-boiling-point solvent:high-boiling-point solvent=3:5. In Comparative Example 10 in which the amount of the low-boiling-point solvent was more than half, the paste state was good and voids were not...

Embodiment 3

[0157] A bonding material was produced in the same manner as in Example 1 except that diethylene glycol hexyl ether (HeDG) having a boiling point of 260° C. was used as a usage example in which a high boiling point solvent was different. The obtained results are shown in Table 1 together. The state of the paste, the generation of voids, the initial bonding strength, and the reliability strength were all good results as in Example 1.

[0158] [Table 1]

[0159]

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Abstract

The purpose of the present invention is to reduce the unevenness in drying between the center and the edge of the bonding layer in the desolvation process of the pre-drying process, so that the bonded surface will not peel off even if it is exposed to repeated thermal shocks after bonding. High bonding. The bonding material of the present invention that solves the above-mentioned problems is characterized by comprising: as main silver particles, nano-silver particles coated with an organic substance having 6 or less carbon atoms and having an average primary particle diameter of 10 to 30 nm; as secondary silver particles, coated with carbon atoms Nano-silver particles coated with organic matter below the number 6 and with an average primary particle size of 100-200nm; two solvents with different boiling points; and a dispersant.

Description

technical field [0001] The present invention relates to a joining material and a joining method using the same, particularly a joining method using nano silver particles for intermetallic joining. Background technique [0002] It is known that when the particle size of a metal becomes finer, physical properties specific to the size are exhibited. In particular, when nanoscale particles are formed, they sometimes show characteristics different from those of bulk materials. Utilizing this property, a joining material between different substances using nano metal ions is proposed. [0003] On the other hand, as automobiles and industrial equipment are electronically controlled, power consumption increases. Therefore, the operating temperature of semiconductors used therein tends to reach high temperatures. Therefore, there is an urgent need for a joining material that can withstand the environment at such a high temperature. In the past, lead-containing solder, which mainta...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F1/02B22F1/00B22F1/052B22F1/054B22F1/102
CPCB22F3/1021B23K35/3006B23K35/365B22F1/054B22F1/052B22F1/102B22F1/056B23K1/203
Inventor 远藤圭一栗田哲永冈实奈美
Owner DOWA ELECTRONICS MATERIALS CO LTD