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A resin polishing disc

A polishing disc, resin technology, applied in abrasives, metal processing equipment, manufacturing tools, etc., to achieve the effect of reducing processing costs, convenient production, and strong plasticity

Active Publication Date: 2016-10-05
TUNGHSU GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, with the changes in society and the market, there is a strong demand for sapphire application products (special-shaped products) of various shapes and thicknesses, and the traditional ceramic grinding discs for CMP polishing substrates are no longer suitable for their ever-changing specifications; we need to find other Low-cost, easy-to-process materials for research and consideration

Method used

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  • A resin polishing disc
  • A resin polishing disc
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Embodiment Construction

[0018] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings.

[0019] Such as figure 1 As shown, the resin polishing disc used for processing sapphire wafers according to the present invention includes a resin grinding tool 1 and a ceramic grinding disc 2 .

[0020] After artificially digging out a square, a circle and a trapezoidal hole 3 on the resin abrasive tool 1, add a small amount of glue or paste wax into the hole 3, and combine the sticking technology to make the ceramic abrasive disc 2 flat and It is bonded so that the ceramic grinding disc and the resin grinding tool are closely matched and bonded together.

[0021] Such as image 3 As shown, there are several glue storage chambers on the bottom surface of the hole of the resin abrasive tool,...

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Abstract

The purpose of the present invention is to provide a resin polishing grinding disc. By developing a mold for the universality of the basic shape of the resin material, and combining the flatness and smoothness of the existing ceramic grinding disc, several ceramic grinding discs of any shape are embedded in the resin grinding tool. , and make the level of the grinding disc lower than the level of the resin to form a depression, so that the sapphire can fit in the depression, so as to develop products of various sizes and specifications for sapphire, so as to improve the processing efficiency and reduce the processing cost.

Description

technical field [0001] The invention relates to a carrier for chemical mechanical polishing and belongs to the technical field of crystal processing. Background technique [0002] Sapphire crystal (α-Al2O3) is a high-quality optical functional material with high sound velocity, high temperature resistance, corrosion resistance, high hardness and wide light transmission band. It has the same hexagonal close-packed type as Group III nitrides, and is an excellent material with a unique combination of physical, mechanical and chemical properties. Due to the wide optical transmission band of sapphire, it has good light transmission from near ultraviolet (190nm) to mid-infrared. Therefore, it is widely used in optical components, infrared devices, high-strength laser lens materials and photomask materials. [0003] At present, the relatively mature technologies for sapphire surface polishing in the industry are diamond polishing technology (DMP) and chemical mechanical polishing...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24D3/28B24D7/06
Inventor 杨华王禄宝
Owner TUNGHSU GRP
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