Thermosetting phenolic resin used for environment-friendly type phenolic aldehyde electronic encapsulating material

Abstract

The invention provides thermosetting phenolic resin used for an environment-friendly type phenolic aldehyde electronic encapsulating material. The thermosetting phenolic resin adopts phenol, phenylamine and paraformaldehyde as raw materials and adopts light magnesium oxide as a catalyst. The weight ratio of the phenol, the paraformaldehyde, the phenylamine and the light magnesium oxide is 63:29:6.3:1.7. The light magnesium oxide is adopted as the catalyst in the process. The synthesized thermosetting phenolic resin is good in fluidity and adhesion in using processes. The paraformaldehyde is adopted in the process, and therefore, for production of each 1000 kg of the resin, discharged waste water is reduced by about 600 kg than discharged water of a traditional process adopting a formaldehyde solution having a concentration of 37%. The electronic encapsulating material produced by adopting the thermosetting phenolic resin as an adhesive has characteristics of good adhesion, good thixotropy and high drying speed, is suitable for large-scale continuous production, is mainly used for external encapsulating of ceramic capacitors, thermistors, piezoelectric ceramic, thick film circuits, and other electronic components, and plays roles of moisture proofness, insulation, mechanical protection, and the like. The electronic encapsulating material is good in heat resistance and good in anti-breakdown strength.

Description

technical field [0001] The invention relates to a thermosetting phenolic resin for an environment-friendly phenolic electronic encapsulation material. The thermosetting phenolic resin is used to manufacture a thermosetting phenolic resin electronic encapsulation material. Outer encapsulation of electronic components such as electric ceramics and thick film circuits. Background technique [0002] The phenolic resin currently sold in the domestic market, whether it is a thermoplastic phenolic resin or a thermosetting phenolic resin, the phenolic electronic encapsulation compound made of it, its manufacturability and production efficiency cannot meet the packaging of electronic components; its heat resistance And breakdown strength can not meet the requirements of electronic components. Contents of the invention [0003] The technical problem to be solved by the present invention is: in order to solve the fact that the manufacturability and production efficiency of phenolic ...

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Problems solved by technology

[0003] The technical problem to be solved by the present invention is: in order to solve the fact that the manufacturability and production efficiency of phenolic electronic encapsulation materials on the market cannot meet the packaging of electronic components, and its heat resistance and breakdown strength cannot meet the requirements of electronic components. In order to solve the problem, an environmentally friendly thermosetting phenolic resin specially used for electronic encapsulation materials was synthesized. The electronic encapsulation materials made of it have a fast drying speed, are suitable for large-scale continuous production, and have excellent heat resistance and high breakdown strength.

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