Chip with micro-electromechanical structure and covering element, and method for the production of same

A technology of micro-electromechanical chips and micro-electro-mechanical structures, which is applied in the field of manufacturing chips with micro-electro-mechanical structures, especially for micro-electro-mechanical loudspeaker components, can solve the problems of complex cost and density, reduce the size of the structure, and increase the integration density , the effect of rapid manufacturing

Inactive Publication Date: 2014-10-08
ROBERT BOSCH GMBH
View PDF8 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such chips require often complex and cost-intensive packaging techniques

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip with micro-electromechanical structure and covering element, and method for the production of same
  • Chip with micro-electromechanical structure and covering element, and method for the production of same
  • Chip with micro-electromechanical structure and covering element, and method for the production of same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] figure 1 A schematic diagram is shown of a chip package 10 with a chip 1 having a microelectromechanical structure, hereinafter referred to simply as a MEMS chip. The chip package 10 includes a MEMS chip 1 which may have, for example, a microelectromechanical loudspeaker structure 1b. The microelectromechanical loudspeaker structure 1b can be embodied in the substrate 1a here. The substrate 1a may, for example, comprise a silicon substrate. The microelectromechanical loudspeaker structure 1b may eg have an array of individual microelectromechanical loudspeaker elements. A protective element 3 can be applied on the surface of the MEMS chip 1 .

[0029] The protective element 3 can for example have a film, for example made of polyethylene terephthalate made of, metal grid, plastic grid or filter layer. The protective element 3 can, for example, be acoustically transparent, that is to say have a high permeability with respect to the propagation of sound waves. At th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a micro-electromechanical chip (1). The chip (1) comprises a substrate (1a); a micro-electromechanical structure (1b) formed in the substrate (1a); and a covering element (3) that is arranged on a surface of the substrate (1a) and that protects the micro-electromechanical structure (1b) from outside contaminants and / or mechanical influences.

Description

technical field [0001] The invention relates to a chip with a microelectromechanical structure and a method for producing a chip with a microelectromechanical structure, in particular for a microelectromechanical loudspeaker element. Background technique [0002] Microelectromechanical speakers (MEMS speakers) are fabricated by building microelectromechanical structures (MEMS structures) in chip material. Such chips require often complex and cost-intensive packaging techniques. [0003] Document DE 10 2005 053 765 A1 discloses, for example, a MEMS package with a MEMS chip and a controller chip which are applied to a carrier substrate and encapsulated by a shield. Contents of the invention [0004] According to one aspect, the invention realizes a microelectromechanical chip with a substrate, a microelectromechanical structure built in the substrate, and a protection element arranged on the surface of the substrate, which protects the microelectromechanical structure from ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/00H04R19/00H04R1/08
CPCH04R1/04B81C1/00269H04R1/06H04R1/086H04R2201/003B81B7/0061H04R31/006B81B7/0077H04R17/00B81B7/0058H04R19/005B81B2201/0257
Inventor A·费伊
Owner ROBERT BOSCH GMBH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap