Equipment convenient for coating of bottoms of printed circuit boards and method thereof

Abstract

The invention relates to the coating technology, in particular to equipment convenient for coating of bottoms of printed circuit boards and a method thereof. The equipment comprises a washing claw system, a horizontal flowing type coating system, a hot air circulating system, a preheating sealing system and a cooling system, all of which are connected to a double-guide rail transmission system in sequence. An air extraction system is arranged above the horizontal flowing type coating system. The horizontal flowing type coating system comprises an incoming board connecting mechanism, a photoelectric sensor, a PLC, a glue barrel and a horizontal flowing wave nozzle valve, wherein the incoming board connecting mechanism is connected with the double-guide rail transmission system; the photoelectric sensor is arranged on the incoming board connecting mechanism; the PLC is connected with the photoelectric sensor and the horizontal flowing wave nozzle valve; and the horizontal flowing wave nozzle valve is connected to the glue barrel through a pipe. The invention further includes a coating method realized based on the equipment. The equipment has the advantages of simple production process, convenience for operation, safety and reliability, low investment cost, high product yield and high production efficiency, and can coat the printed circuit boards of different types in the electronic industry.

Description

technical field [0001] The invention relates to a coating technology on the surface of electronic products, in particular to a device and method for the bottom coating of printed circuit boards. Background technique [0002] Surface coating technology refers to the technology of coating a kind of three-proof material on the surface of the product, and its function is mainly manifested in the waterproof, dustproof and antistatic of the product coating surface. Surface coating is to form a film layer on the surface of the product substrate to improve and protect the surface of the product. The spraying thickness of the surface coating of electronic products is generally tens of microns, or even less. At present, the coating methods in the electronics industry are mainly divided into manual spraying, soaking, brushing, and equipment spraying. [0003] Equipment spraying is to use special spraying equipment to coat the product with three-proof glue. This coating method is curr...

AI Technical Summary

Problems solved by technology

However, there are still great shortcomings in the existing equipment spraying: high equipment investment cost, high price, complicated operation, and low efficiency; in addition, equipment spraying requires personnel to stick to the workplace during the production process, and the equipment spraying process needs to be cleaned and maintained in time , the labor cost is very high; after the equipment is out of service for a period of time, the solvent pipeline needs to be completely replaced when it is used again, which increases the cost of consumables; from the printed circuit board entering the equipment spraying to entering and exiting the curing area, the production status is intermittent during the period, and it is necessary to After a piece of product is sprayed, it enters the inspection station before the next piece of product is allowed to enter the spraying, and the production efficiency is relatively low

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