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Strengthening method of micro-electromechanical system device in manufacture

A technology of micro-electromechanical system and manufacturing process, applied in the direction of manufacturing micro-structure devices, micro-structure technology, micro-structure devices, etc., can solve problems such as fragile fragments

Inactive Publication Date: 2014-10-15
CSMC TECH FAB1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Based on this, in order to solve the problem of fragile MEMS products with special structures during the manufacturing process, it is necessary to provide a reinforcement method for MEMS devices during the manufacturing process

Method used

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  • Strengthening method of micro-electromechanical system device in manufacture

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Embodiment Construction

[0017] In order to make the objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0018] S110, coating a photoresist on the glass sheet.

[0019] In this embodiment, the thickness of the photoresist after glue coating is 1.15±0.15 microns, and the thickness of the photoresist makes it easy to detach in the subsequent degumming step, preferably 1.15 microns. In this embodiment, the photoresist whose type is i7350-13p is selected, and other photoresists known in the art may also be selected in other embodiments.

[0020] S120, aligning and stacking the wafer and the glass sheet.

[0021] The wafer in this embodiment is a wafer of MEMS products with a 350 micron deep groove etching structure on the back side. It can be understood that the present invention is also applicable to other types of MEMS products. In this embodim...

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Abstract

The invention discloses a strengthening method of a micro-electromechanical system device in manufacture. The strengthening method comprises the following steps of 1, coating a glass flake with a photoresist, 2, alignedly stacking the glass flake and a wafer, 3, bonding the glass flake side coated with the photoresist and the wafer by a silicon chip and glass anode bonding technology, and 4, separating the wafer and the glass flake by a photoresist-removal solution used by a wet-type photoresist removal technology. The strengthening method solves the problem of broken wafer in the follow-up transmission process. After perforating corrosion and follow-up transmission, the photoresist is removed by the wet-type photoresist removal technology so that the wafer can be separated from the glass flake easily and thus the strengthening glass flake does not damage the wafer.

Description

technical field [0001] The invention relates to microstructure technology, in particular to a method for reinforcing micro-electromechanical system devices in the manufacturing process. Background technique [0002] For some special products in MEMS (Micro Electro Mechanical Systems, MEMS) devices, such as a micromirror product, it is necessary to etch the wafer (Wafer) into a through-hole cavity with a diameter of 600 microns, so that the combined film (polycrystalline / SiO2, etc.) can be rotated in the cavity to realize functions such as product light splitting / conversion. And because the wafer itself is only 400 microns thick, the subsequent transfer process of the wafer after etching is likely to cause debris. Similarly, MEMS products that adopt the 350-micron process of deep groove etching on the backside also encounter the problem of easy debris when performing the etching process on the front side. [0003] One solution is to thicken the wafer and then thin it after...

Claims

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Application Information

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IPC IPC(8): B81C1/00
CPCB81C1/00B81C1/00825
Inventor 徐春云
Owner CSMC TECH FAB1