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Adhesive tape

A technology of adhesive tape and adhesive layer, applied in the direction of adhesive type, ester copolymer adhesive, polymer adhesive additive, etc. There are no problems such as no effect, and the effect of suppressing the increase of adhesive force, suppressing residual glue, and easy handling is achieved.

Active Publication Date: 2014-10-15
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when a conventional adhesive tape for dicing is used for laser dicing, the following problems arise: the adhesive force of the adhesive tape for dicing increases significantly after laser dicing, and the subsequent processing (for example, cutting semiconductor elements into small pieces) removal, or transfer to another adhesive tape, etc.) becomes difficult, and adhesive residue occurs on the removed adherend
However, through this kind of response, it still has no effect on eliminating the above-mentioned phenomenon.

Method used

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Examples

Experimental program
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Effect test

Embodiment

[0122] Hereinafter, the present invention will be specifically described by way of examples, but the present invention is not limited by these examples. Unless otherwise specified, parts mean parts by weight, and % means % by weight. In addition, the amount of the reagent supplied in the form of a solution is represented by the amount of solid content remaining after volatilizing the solution (solid content conversion amount).

[0123]

[0124] An indentation test was performed on the surface of the pressure-sensitive adhesive layer under the following conditions, and the indentation hardness and indentation modulus of elasticity were determined from the results.

[0125] (measurement device and measurement conditions)

[0126] Device: Tribo Indenter manufactured by Hysitron Inc.

[0127] Indenter used: Berkovich (triangular cone type)

[0128] Measurement method: single indentation measurement

[0129] Measuring temperature: 25°C, 100°C

[0130] Indentation depth setti...

manufacture example 1

[0166] [Manufacturing example 1]: Manufacture of base material

[0167] Manufactured by calendering Contains 27 parts by weight of DOP plasticizer (bis(2-ethylhexyl phthalate), manufactured by J-PLUS Co., Ltd.) with respect to 100 parts by weight of polyvinyl chloride with a degree of polymerization P=1050 soft polyvinyl chloride film. The obtained flexible polyvinyl chloride film had a thickness of 70 μm, an elastic modulus (MD) of 250 MPa measured in accordance with JIS-K-7127 (1999), and a maximum elongation measured in accordance with JIS-K-7127 (1999) (MD) is 400%. In addition, the arithmetic mean surface roughness Ra immediately after production was 0.1 μm.

Embodiment 1

[0169] (non-adhesive layer)

[0170] 60 parts by weight of polysiloxane resin (KS-723A, manufactured by Shin-Etsu Chemical Industry), 40 parts by weight of polysiloxane resin (KS-723B, manufactured by Shin-Etsu Chemical Industry), an acrylic copolymer (methyl methacrylate ( MMA) / butyl acrylate (BA) / hydroxyethyl acrylate (HEA)=70 / 30 / 10) 50 parts by weight, tin-based catalyst (Cat-PS3, manufactured by Shin-Etsu Chemical Co., Ltd.) 10 parts by weight were mixed in a solution state, A mixed solution (1) was obtained. The mixing ratio of polysiloxane and (meth)acrylic polymer in the mixed solution (1) is polysiloxane:(meth)acrylic polymer=2:1 by weight ratio.

[0171] The above-mentioned mixed solution (1) was coated on one side of the flexible polyvinyl chloride film obtained in Production Example 1, and dried to form a non-adhesive layer (1) with a thickness of 1.0 μm and an arithmetic mean surface roughness Ra=0.5 μm.

[0172] In addition, when the non-adhesive layer (1) was o...

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Abstract

The present invention provides an adhesive tape capable of suppressing rise of adhesive force even in the case of being heated due to laser cutting and the like, enabling processing such as taking out of small sheets of semiconductor components and transferring to the other adhesive tape to be easy, and capable of suppressing adhesive residue to an adherend. The adhesive tape of the present invention has an adhesive layer on at least one surface of a substrate, and indentation hardness of a surface of the adhesive layer obtained by using a nanoindentor at the temperature below 100 DEG C is more than 20.0 MPa.

Description

technical field [0001] This invention relates to adhesive tapes. Background technique [0002] Semiconductor chips (chips) are produced by cutting (dicing) a semiconductor wafer on which circuits are formed. For example, by dicing a semiconductor wafer on a dicing adhesive tape, the semiconductor wafer is divided into chips (chips), and the chip is picked up from the dicing adhesive tape and used in a subsequent process (For example, refer to Patent Document 1). In this cutting process, an adhesive tape is used for the purpose of fixing the semiconductor wafer. [0003] In the conventional parting process, a cutting edge such as a rotating edge is used. However, there is a problem in that cutting chips are generated in the cutting process using the cutting edge. Therefore, in recent years, laser dicing in which cutting is performed with a laser has been performed. [0004] However, when a conventional adhesive tape for dicing is used for laser dicing, the following prob...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02C09J133/08C09J11/06C09J11/08
CPCC09J9/00C09J133/04C09J183/04C09J2203/326C09J2433/00C09J2483/00C09J7/22C09J7/245
Inventor 由藤拓三矢田贝隆浩
Owner NITTO DENKO CORP
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