Semiconductor wafer surface protection tape and semiconductor wafer processing method

Abstract

A semiconductor wafer surface-protecting tape having an adhesive layer on a base film, and a method of processing a semiconductor wafer using the tape, wherein the adhesive force to stainless steel at 23°C is 0.3N / 25mm~10N / 25mm, the adhesive force when heated to 50°C is 40% or less of the adhesive force at 23°C, and the contact angle immediately after pure water drops on the surface of the adhesive layer is 100° or more, and the contact angle of pure water 10 minutes after dropping is 65° or more.

Description

technical field [0001] The present invention relates to an adhesive tape for protecting the surface of a semiconductor wafer. In more detail, it is related with the processing method of the tape for semiconductor wafer surface protections used when grinding a semiconductor wafer, and a semiconductor wafer. Background technique [0002] A semiconductor package is manufactured by slicing a high-purity silicon single crystal or the like into a semiconductor wafer, and then forming an integrated circuit on the surface of the wafer by ion implantation, etching, etc., thereby manufacturing a semiconductor package. The semiconductor wafer is processed to a desired thickness by grinding, polishing, or the like on the back surface of the semiconductor wafer on which the integrated circuit is formed. At this time, in order to protect the integrated circuit formed on the surface of the semiconductor wafer, a tape for protecting the surface of the semiconductor wafer (hereinafter also ...

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Problems solved by technology

[0005] However, in the case of using a soft surface protection tape, although the followability is good, there are cases where the adhesive is soft when it is peeled off, and the adhesive may be caught on the uneven height difference on the surface of the semiconductor wafer, and the adhesive may be torn to form a residual adhesive.

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