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Epoxy resin adhesive

A technology of epoxy resin and adhesive, which is applied in the direction of epoxy resin glue, novolac epoxy resin adhesive, adhesive, etc., can solve problems such as difficult coordination, and achieve extended pot life, good insulation performance, and increased mechanical strength. Effect of Strength and Sealing Properties

Inactive Publication Date: 2014-10-15
CHINA XD ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] At present, many combinations of resins and curing agents have good bonding performance, but they have good performance in terms of sealing, mechanical strength, heat resistance, oil resistance and insulation performance, but it is difficult to coordinate

Method used

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  • Epoxy resin adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] An epoxy resin adhesive comprises the following components in parts by weight:

[0026] 40 parts bisphenol A epoxy resin E-39;

[0027] 15 parts of anhydride curing agent HY1235, 15 parts of anhydride curing agent EK860;

[0028] 10 parts toughening agent 820;

[0029] 10 parts thinner 0210;

[0030] 5 parts of reinforcing material nano-scale silicon dioxide;

[0031] 1 part Accelerator DMP-30 and 1 part Accelerator S-440.

Embodiment 2

[0033] An epoxy resin adhesive comprises the following components in parts by weight:

[0034] 30 parts bisphenol A epoxy resin E-44;

[0035] 20 parts of anhydride curing agent HY1235;

[0036] 20 parts of toughening agent 820, 5 parts of toughening agent QS-N;

[0037] 20 parts thinner XY207;

[0038] 8 parts of reinforcing material nano-scale silicon dioxide;

[0039] 0.1 part Accelerator S-440.

Embodiment 3

[0041] An epoxy resin adhesive comprises the following components in parts by weight:

[0042] 20 parts of phenolic resin F-44;

[0043] 20 parts of anhydride curing agent EK860;

[0044] 15 parts toughening agent QS-N;

[0045] 15 parts thinner XY217;

[0046] 10 parts superfine silicon dioxide as reinforcing material;

[0047] 0.5 parts of accelerator DMP-30, 0.3 parts of 2-methylimidazole and 0.9 parts of accelerator 2-ethyl-4-methylimidazole.

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Abstract

The invention discloses an epoxy resin adhesive, which comprises the following components in parts by weight: 20 to 60 parts of epoxy resin, 20 to 50 parts of an acid anhydride curing agent, 5 to 25 parts of a toughening agent, 5 to 15 parts of reinforced materials, 10 to 20 parts of a diluting agent and 0.1 to 2 parts of an accelerant. The epoxy resin adhesive obtained through adopting the method has the characteristics of excellent cohesiveness, sealing property, mechanical strength, heat resistance, oil resistance and insulating property and the like.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to an epoxy resin adhesive. Background technique [0002] At present, in the domestic and foreign glue-impregnated paper casing products, the flange glue-mounted structure is to use adhesive to bond the glue-impregnated paper casing core and flange, on the one hand, it can strengthen the sealing effect between the flange and the core , thereby reducing the risk of sealing problems after flange assembly. On the other hand, the tight fixation between the flange and the core can be made, and the connection strength of the casing can be improved. [0003] In the flange adhesive structure, epoxy resin adhesive is used to fill the gap between the flange and the core of the rubber-impregnated paper sleeve, so that there is no gap between the flange and the core of the adhesive-impregnated paper sleeve, so as to achieve The effect is as follows: [0004] 1. Strengthen the sealing effect between ...

Claims

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Application Information

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IPC IPC(8): C09J163/02C09J163/04C09J11/04C09J11/06
Inventor 岳功轩潘劼
Owner CHINA XD ELECTRIC CO LTD
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