Anisotropic conductive film, connecting method, and joined body

An anisotropic, conductive connection technology, applied in the direction of conductive adhesive connection, conductive adhesive, structural connection of printed circuits, etc., can solve problems such as color change and inability to fully confirm the connection state, and achieve excellent storage stability Effect

Inactive Publication Date: 2014-10-22
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, in these proposed technologies, since the hue changes when one of the heat and the pressure exceeds a predetermined value, there is a possibility that the hue will change even if the other of t...

Method used

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  • Anisotropic conductive film, connecting method, and joined body
  • Anisotropic conductive film, connecting method, and joined body
  • Anisotropic conductive film, connecting method, and joined body

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0150]

[0151] -Production of insulating adhesive layer-

[0152] 47 parts by mass of phenoxy resin (trade name: PKHC, manufactured by Pakistan Industrial Co., Ltd.), 44 parts by mass of urethane acrylate (trade name: EB-600, manufactured by Daicel Corporation), organic peroxide (trade name : 3 parts by mass of パーヘキサ C, manufactured by NOF Corporation, and 6 parts by mass of a color developer (trade name: D-8, manufactured by Nippon Soda Co., Ltd., melting point: 130° C.) were uniformly mixed. The mixed complex was coated on silicone-treated PET (polyethylene terephthalate) with a bar coater so that the average thickness after drying was 8 μm, and dried at 70°C for 5 minutes to produce Insulating adhesive layer.

[0153] -Formation of conductive particle-containing layer-

[0154] 45 parts by mass of phenoxy resin (trade name: PKHJ, manufactured by Pakistan Industrial Co., Ltd.), 46 parts by mass of urethane acrylate (trade name: EB-600, manufactured by Daicel Corporation...

Embodiment 2

[0178]

[0179] -Production of insulating adhesive layer-

[0180] 47 parts by mass of phenoxy resin (trade name: PKHC, manufactured by Pakistan Industrial Co., Ltd.), 38 parts by mass of urethane acrylate (trade name: EB-600, manufactured by Daicel Corporation), organic peroxide (trade name : 3 parts by mass of パーヘキサ C, manufactured by NOF Corporation) and 2 parts by mass of phosphoric acid ester (trade name: PM-21, manufactured by Nippon Kayaku Co., Ltd.) were uniformly mixed. The mixed acidic complex was coated on silicone-treated PET (polyethylene terephthalate) with a bar coater so that the average thickness after drying was 8 μm, and dried at 70° C. for 5 minutes. , making an acidic (pH5.4) insulating adhesive layer.

[0181] In addition, phosphoric acid ester is used to make pH acidic.

[0182] The insulating adhesive layer obtained above and the conductive particle-containing layer obtained in Example 1 were laminated at a roll temperature of 45° C. using a roll la...

Embodiment 3

[0186]

[0187] -Production of insulating adhesive layer-

[0188] 47 parts by mass of phenoxy resin (trade name: PKHC, manufactured by Pakistan Industrial Co., Ltd.), 38 parts by mass of urethane acrylate (trade name: EB-600, manufactured by Daicel Corporation), organic peroxide (trade name : 3 parts by mass of Pahekisa C, manufactured by NOF Corporation) and 2 parts by mass of a silane coupling agent (trade name: KBE-903, manufactured by Shin-Etsu Chemical Co., Ltd.) were uniformly mixed. The mixed basic complex was coated on silicone-treated PET (polyethylene terephthalate) with a bar coater so that the average thickness after drying was 8 μm, and dried at 70° C. for 5 Minutes to make an alkaline (pH9.2) insulating adhesive layer.

[0189] -Formation of conductive particle-containing layer-

[0190] 45 parts by mass of phenoxy resin (trade name: PKHJ, manufactured by Pakistan Industrial Co., Ltd.), 46 parts by mass of urethane acrylate (trade name: EB-600, manufactured ...

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Abstract

An anisotropic conductive film allowing anisotropic conductive connection between terminals of a first circuit part and terminals of a second circuit part comprises a first layer containing film forming resin and a second layer containing film forming resin. At least one of the first layer and the second layer contains conductive particles. One of the first layer and the second layer contains leuco dye and the other contains a hue change agent which interacts with the leuco dye to make the hue of the anisotropic conductive film change.

Description

technical field [0001] The present invention relates to an anisotropic conductive film, a connection method and a bonded body. Background technique [0002] At present, as a means of connecting electronic parts and substrates, a strip-shaped connecting material (for example, anisotropic conductive film (ACF; Anisotropic Conductive Film) coated with a thermosetting resin dispersed with conductive particles on a release film is used. ). [0003] This anisotropic conductive film is mainly used, for example, to connect a terminal of a flexible printed circuit board (FPC) or an IC (Integrated Circuit) chip to an electrode formed on a glass substrate of an LCD (Liquid Crystal Display) panel. A case where electrical connections are made while various terminals are bonded to each other. [0004] Conventionally, confirmation of the connection state using the anisotropic conductive film is carried out by analyzing and measuring the degree of curing using equipment such as infrared s...

Claims

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Application Information

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IPC IPC(8): C09J7/02H01R4/04H01R43/00
CPCB32B7/025C09J7/00C09J9/02H01B5/14H05K1/14H05K3/32
Inventor 冢尾怜司
Owner DEXERIALS CORP
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