Driving mechanism used for driving magnetron, and magnetron sputtering processing apparatus

Abstract

The invention provides a driving mechanism used for driving a magnetron, and a magnetron sputtering processing apparatus. The driving mechanism comprises a rotary driving source, a transmission shaft and a linear driving source, wherein the linear driving source is used for driving the magnetron to linearly move back and forth along a direction perpendicular to the transmission shaft in a hydraulic driving mode; and the driving shaft of the rotary driving source is fixedly connected with the linear driving source by means of the transmission shaft, and is also used for driving the magnetron to move around the transmission shaft in a rotary manner during the linear reciprocating movement of the magnetron. The driving mechanism used for driving the magnetron allows the running locus of the magnetron completely cover a whole target material and the distribution density of the running locus of the magnetron tend to uniformity, and is also suitable for target materials with many dimensions in order to enlarge the application range of the driving mechanism.

Description

technical field [0001] The invention belongs to the field of plasma processing equipment, and relates to a driving mechanism for driving a magnetron and magnetron sputtering processing equipment. Background technique [0002] In the microelectronics industry, magnetron sputtering technology is one of the important means of producing integrated circuits, liquid crystal displays, thin-film solar cells and LEDs, and plays a great role in industrial production and scientific fields. In recent years, the market's growing demand for high-quality products has prompted companies to continuously improve magnetron sputtering equipment. [0003] figure 1 It is a schematic diagram of a typical magnetron sputtering processing equipment. like figure 1 As shown, the magnetron sputtering processing equipment includes a reaction chamber 11, and an electrostatic chuck 15 is provided at the bottom of the reaction chamber 11 to carry the workpiece to be processed; A target 12 is arranged at...

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Problems solved by technology

Depend on Figure 2b It can be seen that not only the track range of the magnetron driven by the above-mentioned driving mechanism cannot cover the entire target area, but also the density of the scanning track of the magnetron in the area covered by the track of the magnetron is not uniform, resulting in a reduction in target utilization

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