Ion film-plating device and ion film-plating method

Abstract

The invention discloses an ion film-plating device and an ion film-plating method. In the ion film-plating device, a magnetic-control target is designed into a cylinder shape, all sputtering is completed inside the cylindrical target source, a bias power supply is adopted to lead out an ion beam flow to be deposited on a workpiece, therefore, ions which are electrically neutral or are not ionized cannot be attracted out by an electric field, and thus ion deposition can achieve 100%. In addition, as sputtering of the magnetic-control sputtering target source is carried out in the cylinder, even through arcing is generated, generation is carried out just inside the cylinder, and the film plated workpiece cannot be affected, and the arcing is avoided from affecting film plating. Furthermore, the target source ions are led out of the cylinder by the bias power supply, target voltage attraction on the ions after leading out is weakened, and at the same time, the area of the led-out beam flow is far smaller than the target surface area, so that the led-out beam flow density is greatly improved, and the deposition rate is effectively improved.

Description

technical field [0001] The present application relates to the field of ion plating, in particular to an ion plating device and an ion plating method. Background technique [0002] Plasma surface treatment and coating technology has been widely used in industrial engineering fields such as tools, molds, and mechanical protection, as well as in daily life such as thin-film solar cells, lithium batteries, and mobile phones, watches, and lighting. As far as industrial coatings are concerned, in 2007, Balzers Coatings estimated based on its sales data and market research data in China that the total PVD coating market in China was about RMB 400-500 million in 2007. The potential is about 800-100 million RMB, and the data is growing rapidly at a rate of 10%-20% per year. [0003] At present, there are two most widely used plasma coating technologies, magnetron sputtering and cathodic arc ion plating. These two technologies have their own advantages and disadvantages. The deposit...

AI Technical Summary

Problems solved by technology

However, according to an article by Anders, this technology works in the abnormal glow discharge stage close to arc discharge, and it is easy to transition to arc discharge to produce "arcing", the discharge is unstable, and for different target materials, the deposited particles are ionized The rate difference is large, it is difficult to obtain 100% ionized beam current (A.Anders.High power impulse magnetron sputtering: Current-voltage-time characteristic indicate the onset of sustained self-sputtering.J.Appl.Phys.2007,102 :113303)

In addition, Christie's research also shows that due to the low potential of the target voltage, the ionized sputtering material ions are sucked back to the target surface under the action of the electric field, resulting in a low deposition rate of the technology (D.J.Christie.Fundamentals of high power pulsed magnetron sputtering:visualization of mechanisms for rate reduction and increased.Czech.J.Phys.2006,56:B93)

Images