Inner electrode conductive gold pulp applied to low temperature co-fired ceramic, and preparation method thereof
A technology of low-temperature co-fired ceramics and internal electrodes, which is applied in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc. It can solve the problems of unsatisfactory conductivity of microwave dielectric materials and achieve high performance Reliable, good printability, good co-firing matching effect
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[0029] Example 1
[0030] This embodiment provides an internal electrode conductive gold paste applied to low-temperature co-fired ceramics. The internal electrode conductive gold paste includes the following components in terms of mass ratio: 70% gold particles, 10% inorganic additives, 15% % Carrier, 0.5% auxiliary, and 4.5% solvent.
[0031] As an example, the gold particles are selected from gold powders with a spherical morphology and a particle size selected from a D50 of 1 to 3 microns and a D90 of no more than 5 microns.
[0032] As an example, the inorganic additive includes the following components in parts by weight: 25 parts of Al 2 O 3 , 40 parts of SiO 2 , 5 parts of Bi 2 O 3 , 20 parts of CaCO 3 , And 10 parts of SrCaO 3 .
[0033] As an example, the carrier includes a mixture of the following components in terms of mass ratio: 30% special resin and 70% solvent. Further, the special resin is selected from esters, and the solvent is selected from alcohols.
[0034] As an...
Example Embodiment
[0041] Example 2
[0042] This embodiment provides an internal electrode conductive gold paste applied to low-temperature co-fired ceramics. The internal electrode conductive gold paste includes the following components in terms of mass ratio: 92% gold particles, 1% inorganic additives, 4 % Carrier, 0.3% additives, and 2.7% solvent.
[0043] As an example, the gold particles are selected from gold powders with a flake-like morphology and a particle size selected from a D50 of 1 to 3 microns and a D90 of not more than 5 microns.
[0044] As an example, the inorganic additive includes the following components in parts by weight: 20 parts of Al 2 O 3 , 35 parts of SiO 2 , 10 parts of Bi 2 O 3 , 20 parts of CaCO 3 , And 15 parts of SrCaO 3 .
[0045] As an example, the carrier includes a mixture of the following components in terms of mass ratio: 10% special resin and 90% solvent. Further, the special resin is selected from alcohol esters, and the solvent is selected from ethers.
[0046]...
Example Embodiment
[0052] Example 3
[0053] This embodiment provides an internal electrode conductive gold paste applied to low-temperature co-fired ceramics. The internal electrode conductive gold paste includes the following components in terms of mass ratio: 85% gold particles, 5% inorganic additives, 8 % Carrier, 1% auxiliary, and 1% solvent.
[0054] As an example, the gold particle size is selected from gold powders with a D50 between 1 and 3 microns and a D90 not greater than 5 microns, and the morphology is 50 flakes and 50 spherical powders.
[0055] As an example, the inorganic additive includes the following components in parts by weight: 20 parts of Al 2 O 3 , 15 parts of SiO 2 , 35 parts of Bi 2 O 3 , 25 parts of CaCO 3 , And 5 parts of SrCaO 3 .
[0056] As an example, the carrier includes a mixture of the following components in terms of mass ratio: 20% special resin and 80% solvent. Further, the special resin is cellulose, and the solvent is alcohol.
[0057] As an example, the componen...
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