Inner electrode conductive gold pulp applied to low temperature co-fired ceramic, and preparation method thereof
A technology of low-temperature co-fired ceramics and internal electrodes, which is applied in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc. It can solve the problems of unsatisfactory conductivity of microwave dielectric materials and achieve high performance Reliable, good printability, good co-firing matching effect
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Embodiment 1
[0030] This embodiment provides a conductive gold paste for internal electrodes applied to low-temperature co-fired ceramics. The conductive gold paste for internal electrodes includes the following components in terms of mass ratio: 70% gold particles, 10% inorganic additives, 15% % carrier, 0.5% adjuvant, and 4.5% solvent.
[0031] As an example, the gold particles are selected from gold powders whose morphology is spherical and whose particle size is selected from gold powders whose D50 is between 1 and 3 microns and whose D90 is not greater than 5 microns.
[0032] As an example, the inorganic additives include the following components in parts by weight: 25 parts of Al 2 o 3 , 40 parts of SiO 2 , 5 copies of Bi 2 o 3 , 20 parts of CaCO 3 , and 10 parts of SrCaO 3 .
[0033] As an example, the carrier includes a mixture of the following components in mass ratio: 30% specialty resin, and 70% solvent. Further, the special resin is selected from esters, and the solven...
Embodiment 2
[0042] This embodiment provides a conductive gold paste for internal electrodes applied to low-temperature co-fired ceramics. The conductive gold paste for internal electrodes includes the following components in terms of mass ratio: 92% gold particles, 1% inorganic additives, 4 % carrier, 0.3% adjuvant, and 2.7% solvent.
[0043] As an example, the gold particles are selected from gold powders whose morphology is flake-like, and whose particle size is selected from gold powder whose D50 is between 1-3 microns and whose D90 is not greater than 5 microns.
[0044]As an example, the inorganic additives include the following components in parts by weight: 20 parts of Al 2 o 3 , 35 parts of SiO 2 , 10 copies of Bi 2 o 3 , 20 parts of CaCO 3 , and 15 parts of SrCaO 3 .
[0045] As an example, the carrier includes a mixture of the following components in mass ratio: 10% specialty resin, and 90% solvent. Further, the special resin is selected from alcohol esters, and the solv...
Embodiment 3
[0053] This embodiment provides a conductive gold paste for internal electrodes applied to low-temperature co-fired ceramics. The conductive gold paste for internal electrodes includes the following components in terms of mass ratio: 85% gold particles, 5% inorganic additives, 8% % carrier, 1% adjuvant, and 1% solvent.
[0054] As an example, the size of the gold particles is selected from gold powder whose D50 is between 1 and 3 microns and whose D90 is not greater than 5 microns, and the shape is flake 50 parts and spherical 50 powders.
[0055] As an example, the inorganic additives include the following components in parts by weight: 20 parts of Al 2 o 3 , 15 parts of SiO 2 , 35 copies of Bi 2 o 3 , 25 parts of CaCO 3 , and 5 parts of SrCaO 3 .
[0056] As an example, the carrier includes a mixture of the following components in mass ratio: 20% specialty resin, and 80% solvent. Further, the special resin is cellulose, and the solvent is alcohol.
[0057] As an exa...
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Abstract
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