Special base board for drilling thick copper foil board and preparation method of special base board for drilling thick copper foil board

Abstract

The invention discloses a special base board for drilling a thick copper foil board and a preparation method of the special base board for drilling the thick copper foil board. Binding resin and an adjuvant of which the mass fraction is 0-5% are stirred evenly, and a reinforcing material is coated with the mixed binding resin and adjuvant in a roller painting manner, so as to prepare the special base board for drilling the thick copper foil board, wherein the surface layer of the base board is a binding resin layer, and the bottom layer of the base board is a reinforcing material layer. The special base board for drilling the thick copper foil board, disclosed by the invention, can be tightly combined with the thick copper foil board to be drilled, so that the thick copper foil board is prevented from generating burrs, and the problem that plenty of burrs are generated when a conventional base board is drilled is avoided. The later tinning and copper plating process of the prepared thick copper foil board is prevented from being affected by the burrs, a prepared circuit board is high in circuit signal transmission speed, small in energy loss and good in conductivity, and the special base board has the good industrial production value and application prospect.

Description

technical field [0001] The invention relates to the field of PCB processing and preparation, in particular to a backing plate specially used for drilling thick copper foil boards and a preparation method thereof. Background technique [0002] As the substrate material in the manufacture of printed circuit boards, thick copper foil boards are widely used in the electronics industry. They mainly play the role of interconnection, conduction, insulation and support for printed circuit boards. Therefore, the performance, quality, processability in manufacturing, manufacturing level, manufacturing cost, and long-term reliability and stability of printed circuit boards depend to a large extent on tin plating, copper plating technology. However, the thick copper foil board itself is prone to warping and deformation. Due to the rigidity of the traditional phenolic and epoxy backing boards during drilling, they cannot be tightly combined with them, which easily causes a local gap bet...

AI Technical Summary

Problems solved by technology

[0004] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide a special backing plate for drilling thick copper foil boards and its preparation method and use method, aiming to solve the problem that burrs occur when drilling thick copper foil boards and affect the post-processing. quality problem

Images