High-energy ion injection device
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- SENCORP
- Publication Date
- 2014-12-03
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Abstract
Description
technical field
[0001] This application claims priority based on Japanese Patent Application No. 2013-111364 filed on May 27, 2013. The entire content of this application is incorporated in this specification by reference.
[0002] The invention relates to a high-energy ion implantation device. Background technique
[0003] In the manufacturing process of semiconductor elements, an important process for adding impurities to the crystal of the semiconductor wafer by implanting ions into the semiconductor wafer under vacuum to change the conductivity and make the semiconductor Wafer semiconductor components. The device used in this process is called an ion implantation device, and the ion implantation device accelerates impurity atoms as ions and implants them into the semiconductor wafer.
[0004] With the high integration and high performance of semiconductor elements, devices capable of performing high-energy ion implantation to penetrate deeper into semiconductor wafers...