Little-defect clean Sn-Zn solder containing palladium and preparing method thereof

A technology of sn-zn and solder, applied in manufacturing tools, welding equipment, metal processing equipment, etc., can solve problems such as poor comprehensive performance, reduce brazing pores, increase diffusion speed and depth, and improve smoothness.

Active Publication Date: 2014-12-10
ZHENGZHOU RES INST OF MECHANICAL ENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

"Sn-Zn-Ga-Ce lead-free solder" has been developed on the basis of Sn-Zn, such as Chinese invention patent: a kind of tin-zinc base lead-free solder alloy announced by publication number CN101585120, published by publication number CN101058131 A kind of Sn-Zn lead-free solder alloy of Sn-Zn system and its preparation method and the Sn-Zn solder of multiple " multi-element alloy system " such as tin-zinc base containing rare earth element lead-free solder alloy published by Publication No. CN1390672, they and Compared with the binary Sn-Zn alloy solder, some properties have been improved, but the overall performance is not as good as the traditional Sn-Pb solder. Therefore, the Sn-Zn solder still needs further improvement.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Prepare 100kg palladium-containing slightly clean Sn-Zn solder, its composition requirements are: Pd: 0.05%, Ga: 0.1%, In: 6%, Ag: 0.3%, Zn: 7.5%, and the balance is Sn.

[0025] The preparation method is:

[0026] a. Put 0.05kg of palladium (sponge palladium) into a hydrogen furnace at 800°C to absorb hydrogen for 2 hours, take it out and cool it, and grind it into fine powder for later use;

[0027] b. Melting 0.3kg of metallic silver and 0.9kg of metallic tin into 1.2kg of silver-tin master alloy;

[0028] c. After melting the remaining 85.15kg of metal tin and 1.2kg of silver-tin intermediate alloy smelted in the second step, add 7.5kg of metal zinc after the temperature of the melt in the furnace rises to 420°C, and wait until it is completely melted , keep warm for 15 minutes to obtain Sn-Zn-Ag intermediate alloy liquid;

[0029] d. Add 6kg of metal indium and 0.1kg of metal gallium into the Sn-Zn-Ag master alloy liquid in order to melt, and when the temperature...

Embodiment 2

[0033] Prepare 100kg palladium-containing slightly clean Sn-Zn solder, its composition requirements are: Pd: 0.08%, Ga: 0.2%, In: 6%, Ag: 0.3%, Zn: 7%, and the balance is Sn.

[0034] The preparation method is the same as in Example 1.

Embodiment 3

[0036] Prepare 100kg palladium-containing slightly clean Sn-Zn solder, its composition requirements are: Pd: 0.1%, Ga: 0.2%, In: 8%, Ag: 0.5%, Zn: 8%, and the balance is Sn.

[0037] The preparation method is the same as in Example 1.

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PUM

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Abstract

The invention discloses little-defect clean Sn-Zn solder containing palladium. The solder comprises metal components including, by weight, 0.05-0.3% of Pd, 0.1-0.5% of Ga, 6-10% of In, 0.1-3.5% of Ag, 7-10% of Zn and the balance Sn. During preparation, the palladium is ground into powder for use after hydrogen absorption, and silver and tin are smelted into silver-tin intermediate alloy in proportion; remaining tin and the molten silver-tin intermediate alloy are placed in a furnace for melting, raw material zinc is added after temperature of molten liquid rises to 350-450 DEG C, heat preservation is carried out, and Sn-Zn-Ag intermediate alloy liquid is obtained; raw material indium and gallium are sequentially added, when the temperature of the molten liquid lowers to 250-350 DEG C, heat preservation is carried out, and Sn-Zn-Ag-In-Ga intermediate alloy liquid is obtained; palladium powder is added and is covered with a mixture of zinc chloride and vegetable oil after complete melting, heat preservation is carried out, and the mixture is poured to form cast ingot; the solder can be obtained after the cast ingot is extruded and drawn or rolled into a wire shape or a flaky shape. The solder has the advantages of being high in cleanliness, high wettability, little in soldering seam defect, low in melting point and the like.

Description

technical field [0001] The invention relates to a brazing filler metal for zinc-aluminum alloy brazing, in particular to a palladium-containing poorly clean Sn-Zn brazing filler metal, and also relates to a preparation method of the brazing filler metal. Background technique [0002] Zinc alloys, especially wrought zinc alloys, have excellent comprehensive properties and become ideal substitutes for copper alloys in some fields, and have broad application prospects in cluster industries such as electronic communications, sanitary ware, hardware construction, electromechanical, and clothing. Many industries such as sanitary ware, hardware, home appliances and other light industries have used wrought zinc alloys to manufacture structural parts, so replacing copper structures with zinc-aluminum alloys is bound to become a development direction of the manufacturing industry. [0003] At present, low-temperature soft soldering is generally used for zinc alloy brazing at home and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/40
CPCB23K35/262B23K35/40
Inventor 黄俊兰龙伟民张青科马佳裴夤崟钟素娟于新泉郭艳红周许升张冠星
Owner ZHENGZHOU RES INST OF MECHANICAL ENG CO LTD
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