AMOLED (Active Matrix Organic Light Emitting Diode) structure and production method thereof
A manufacturing method and packaging layer technology, applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve problems such as thinning and inability to fully utilize the back of TFT, and achieve the effect of reducing the overall thickness
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[0032] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.
[0033] see figure 1 , shows a schematic cross-sectional view of an AMOLED structure of the present invention. The AMOLED structure of the present invention discloses a kind of AMOLED structure in which a semiconductor silicon chip is used to replace plexiglass as a substrate, and the back side of the substrate is used to make a mainboard circuit. The original substrate of the motherboard circuit and the wiring space for electrical connection between the motherboard circuit and the TFT circuit can effectively reduce the overall thickness of the AMOLED. In the packaging of the existing AMOLED structure, the TFT circuit and the OLED device layer are formed on the glass substrate, and then the main board circuit is made separately, and the main board circuit and the TFT circuit are electrically connected, and then the above structures are packaged ...
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