Production process of semi-finished rigid-flexible printed circuit boards

A printed circuit board, soft and hard combination technology, applied in the direction of assembling printed circuits with electrical components, multi-layer circuit manufacturing, etc., can solve problems such as loss of voltage, dielectric layer voids, copper surface wrinkles, etc., to increase production requirements and avoid Copper surface wrinkles and dielectric layer voids reduce work intensity and error rate

Inactive Publication Date: 2014-12-10
GULTECH WUXI ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] 1. The copper surface is wrinkled after pressing;
[0008] 2. The dielectric layer is hollow and depressurized

Method used

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  • Production process of semi-finished rigid-flexible printed circuit boards
  • Production process of semi-finished rigid-flexible printed circuit boards

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] A production process of a soft-hard combined semi-finished printed circuit board comprises the following steps:

[0036] a. Place the lower chassis 2 under the upper chassis 1;

[0037] b. Place two groups of 15 layers of kraft paper between the upper chassis and the lower chassis;

[0038] c. Place 11 layers of steel plates 4 between two sets of kraft paper;

[0039] d. A layer of rigid-flex semi-finished board 5 is placed between two adjacent layers of steel plates 4 to form a rigid-flex laminate; and the semi-finished board 5 is composed of copper foil layer 5.1, semi-cured resin layer 5.2 and The flexible circuit board 5.3 is composed of several layers of copper foil layers 5.1 on the upper surface of the flexible circuit board 5.3, and a semi-cured resin layer 5.2 is provided between the two adjacent copper foil layers 5.1 above the flexible circuit board 5.3. Several copper foil layers 5.1 are provided on the lower surface of the flexible circuit board 5.3, and ...

Embodiment 2

[0051] A production process of a soft-hard combined semi-finished printed circuit board comprises the following steps:

[0052] a. Place the lower chassis 2 under the upper chassis 1;

[0053] b. Place two groups of 17-layer kraft paper 3 between the upper chassis and the lower chassis;

[0054] c. Place 13 layers of steel plates 4 between two sets of kraft paper;

[0055] d. A layer of rigid-flex semi-finished board 5 is placed between two adjacent layers of steel plates 4 to form a rigid-flex laminate; and the semi-finished board 5 is composed of copper foil layer 5.1, semi-cured resin layer 5.2 and The flexible circuit board 5.3 is composed of several layers of copper foil layers 5.1 on the upper surface of the flexible circuit board 5.3, and a semi-cured resin layer 5.2 is provided between the two adjacent copper foil layers 5.1 above the flexible circuit board 5.3. Several copper foil layers 5.1 are provided on the lower surface of the flexible circuit board 5.3, and a ...

Embodiment 3

[0067] A production process of a soft-hard combined semi-finished printed circuit board comprises the following steps:

[0068] a. Place the lower chassis 2 under the upper chassis 1;

[0069] b. Place two sets of 20 layers of kraft paper 3 between the upper chassis and the lower chassis;

[0070] c. Place 15 layers of steel plates 4 between two sets of kraft paper;

[0071] d. A layer of rigid-flex semi-finished board 5 is placed between two adjacent layers of steel plates 4 to form a rigid-flex laminate; and the semi-finished board 5 is composed of copper foil layer 5.1, semi-cured resin layer 5.2 and The flexible circuit board 5.3 is composed of several layers of copper foil layers 5.1 on the upper surface of the flexible circuit board 5.3, and a semi-cured resin layer 5.2 is provided between the two adjacent copper foil layers 5.1 above the flexible circuit board 5.3. Several copper foil layers 5.1 are provided on the lower surface of the flexible circuit board 5.3, and ...

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PUM

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Abstract

The invention relates to a production process of semi-finished rigid-flexible printed circuit boards. The production process includes the steps: placing two groups of kraft paper between an upper steel plate and a lower steel plate, placing a steel plate between the two groups of kraft paper, and placing a semi-finished rigid-flexible board between the two adjacent steel plates to form a laminated semi-finished rigid-flexible board, wherein the semi-finished rigid-flexible board is composed of a copper foil layer, a semi-cured resin layer and a flexible circuit board; putting the laminated semi-finished rigid-flexible board into a press chamber of an oil press, and enabling a pressure plate of the oil press to integrally press each lamination of the laminated semi-finished rigid-flexible board to obtain the semi-finished rigid-flexible printed circuit board. The production process of the semi-finished rigid-flexible printed circuit boards has the advantages that compression loss abnormality, dielectric layer void and copper face creasing of the semi-finished rigid-flexible printed circuit boards can be avoided, yield demands of a production line are increased, and work intensity is relieved for personnel while error rate is decreased. The production process is especially applicable to massive lamination processing of high-density interconnected rigid-flexible printed circuit boards.

Description

technical field [0001] The invention relates to a pressing process of a high-density interconnect printed circuit board with a soft and rigid combination, and in particular to a production process for a semi-finished printed circuit board with a soft and rigid combination. Background technique [0002] With the development trend of thinner, thinner, integrated and multi-functional consumer electronic products, the requirements for the production process of printed circuit rigid-flex boards are getting higher and higher. Following this trend, rigid-flex boards with flexible board surface treatment and multiple-pressed back-opening designs will gradually become an important part of various consumer electronics printed circuit boards. The high-density interconnected printed circuit rigid-flex board with flexible board surface treatment and multiple pressing back-opening design is the soft board part of the printed circuit board with gold plating, gold plating, etc., hard board ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K3/36
Inventor 华福德
Owner GULTECH WUXI ELECTRONICS CO LTD
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