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LED substrate structure and manufacturing method thereof

A technology of substrate structure and fabrication method, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of high cost, insufficient luminous brightness, easy to crack, etc., to reduce invisible costs, avoid technical bottlenecks, and achieve low-cost solutions. Effect

Active Publication Date: 2017-03-22
HANGZHOU SILAN AZURE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The purpose of the present invention is to provide an LED substrate structure and its manufacturing method to solve the problems of the existing LEDs, such as insufficient luminous brightness, or easy splitting during the manufacturing process, and high cost.

Method used

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  • LED substrate structure and manufacturing method thereof
  • LED substrate structure and manufacturing method thereof
  • LED substrate structure and manufacturing method thereof

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Embodiment 1

[0056] Please refer to figure 1 , which is a schematic flow chart of the manufacturing method of the LED substrate structure according to Embodiment 1 of the present invention. Such as figure 1 As shown, the manufacturing method of the LED substrate structure includes:

[0057] Step S10: providing a substrate;

[0058] Step S11: etching the substrate to form convex structures arranged in a periodic array on the first surface of the substrate;

[0059] Step S12: forming a DBR film system on the first surface of the substrate between the outer wall of the convex structure and the convex structure, wherein the substrate between the top wall of the convex structure and the convex structure is first The DBR film on the surface is provided with an array of nano-windows exposing portions of the top walls of the convex structures and the first surface of the substrate between the convex structures.

[0060] Specifically, please refer to Figure 2 ~ Figure 1 2. It is a schematic c...

Embodiment 2

[0081] Please refer to Figure 13 , which is a schematic flow chart of the manufacturing method of the LED substrate structure according to the second embodiment of the present invention. Such as Figure 13 As shown, the manufacturing method of the LED substrate structure includes:

[0082] Step S30: providing a substrate;

[0083] Step S31: etching the substrate to form concave structures arranged in a periodic array on the first surface of the substrate;

[0084] Step S32: forming a DBR film system on the first surface of the substrate between the inner wall of the concave structure and the concave structure, wherein the substrate between the bottom wall of the concave structure and the concave structure is first The DBR film system on the surface is provided with a nano-window array, and the nano-window array exposes part of the bottom wall of the concave structure and the first surface of the substrate between the concave structures.

[0085] Specifically, please refer...

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Abstract

The invention provides an LED (light emitting diode) substrate structure and a manufacturing method thereof. The luminous efficiency and the luminous brightness of LEDs (light emitting diodes) can be effectively improved by organically combining a patterned substrate technology and a DBR (distributed bragg reflector) technology; a convex structure or a concave structure and a DBR film system are positioned on the same surface of a substrate and are finished before the substrate is thinned, machining and follow-up cleaning treatment are facilitated, and implicit cost in an LED machining process is undoubtedly reduced; when a nanometer window array of the DBR film system is manufactured, alignment is not required, exposure and development are performed directly, and the technical bottleneck of difficult alignment on photoetching in a micro-nanometer graph machining process is avoided; and in a word, the manufacturing method of the LED substrate structure is simple in process, low in cost and suitable for large-scale commercial production, the luminous efficiency and the luminous brightness of the LED can be effectively improved by the LED substrate structure, the industrialization process of the LED entering the field of high-end illumination and ordinary families can be accelerated, and the LED substrate structure conforms to the strategy of sustainable development on the LED.

Description

technical field [0001] The invention relates to the technical field of semiconductor optoelectronic chip manufacturing, in particular to an LED substrate structure and a manufacturing method thereof. Background technique [0002] With the improvement of people's living standards, the enhancement of environmental awareness, and the continuous improvement of the pursuit of home environment, leisure and comfort, lamps and lanterns have gradually shifted from simple lighting functions to the coexistence of lighting and decoration. It is inevitable that solid-state cold light source LED will replace traditional light source and enter people's daily life. [0003] Since the commercialization of GaN-based LEDs in the early 1990s, after more than 20 years of development, its structure has become mature and perfect, and it has been able to meet people's current needs for lighting decoration; but it must completely replace traditional light sources and enter the lighting industry. fi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/22H01L33/46H01L33/00
CPCH01L33/0066H01L33/0075H01L33/22H01L33/46H01L2933/0025
Inventor 丁海生马新刚李东昇李芳芳江忠永
Owner HANGZHOU SILAN AZURE