Heat field structure for fast increasing growth speed of czochralski silicon single crystal
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- TIANJIN HUANOU SEMICON MATERIAL TECH CO LTD
- Publication Date
- 2015-01-28
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention belongs to the field of silicon single crystal preparation devices, and in particular relates to a thermal field structure for rapidly increasing the growth rate of Czochralski silicon single crystal. Background technique
[0002] Czochralski growth of monocrystalline silicon is currently the most widely used technology for the production of monocrystalline silicon. With the continuous development of the photovoltaic industry, it is necessary to improve production efficiency and reduce costs under the premise of ensuring quality. The most direct way to improve production efficiency is to increase the speed of equal-diameter crystal growth and shorten the crystal pulling time. Firstly, it is necessary to increase the axial temperature gradient of the crystal to increase the release of latent heat of crystallization, and secondly, reduce the axial temperature gradient in the melt at the crystallization interface.
[0003] A Czochralski sil...